| Allicdata Part #: | ATS-18B-76-C3-R0-ND |
| Manufacturer Part#: |
ATS-18B-76-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18B-76-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks - ATS-18B-76-C3-R0 Application Field and Working Principle
The ATS-18B-76-C3-R0 is a common type of heat sink utilized in many industrial and consumer electronics applications. Heat sinks are customarily constructed out of aluminum, copper, or other metals in order to dissipate heat more efficiently. Such components are utilized to transfer the heat from a device into a medium – typically air – to keep it at a regulated temperature. The ATS-18B-76-C3-R0 is designed to provide a more efficient and reliable thermal path between processor and air.
Application Field
The ATS-18B-76-C3-R0 component is used in a variety of applications, ranging from desktop computers and gaming consoles to communications systems and audio/video players. Its large cooling capacity is especially useful in environments where high core temperatures pose an issue. In addition, the component is widely used in the automotive industry, given its reliability and heat dissipation capability.
Working Principle
Heat sinks work by providing an increased surface area for heat dissipation, allowing more heat to escape the internal environment. ATS-18B-76-C3-R0 is a three-layer device consisting of a base plate, a heat radiating sheet, and a heat-dissipating fin. The base plate is the bottom layer, which must be placed directly against a processor such as a CPU or GPU. The heat which is generated by the processor will be conducted into the base plate, and is then distributed to the radiating sheet.
The radiating sheet is the middle layer, which is connected to the base plate via microscopic “fins”. These fins increase the surface area for heat dissipation, maximizing the amount of heat energy that can be transferred from the processor. The heat is then passed on to the outer “cooling heatsink fins” on the top layer.
At the top layer, the fins act as a heat dissipator, allowing the heat energy to escape from the device. To maximize the contact of these fins with the air, the component is designed with a unique wavy line pattern which increases air circulation to the heat-dissipating fins. This pattern is designed to help improve the efficiency of the heat transfer process by increasing the amount of air exposed to the fins.
The ATS-18B-76-C3-R0 is an extremely important component of many industrial and consumer electronic devices. The component is designed to provide effective, reliable, and efficient thermal management capabilities in order to ensure safe operation. The large cooling capacity of the component ensures that the processor stays cooler than its maximum rated temperature, while the unique wave pattern increases air circulation to further improve heat dissipation performance.
The specific data is subject to PDF, and the above content is for reference