Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.97°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-18B-82-C3-R0 Thermal Heat Sink Technology

The ATS-18B-82-C3-R0 thermal heat sink is a versatile and powerful product for adding cooling and air flow to an electronic system. It is used in a wide variety of applications, from server farms and data centers to industrial manufacturing and automotive cooling systems. The ATS-18B-82-C3-R0 heat sink utilizes a combination of metal structure, air baffles, and combination of fins to prolong the life of your electronic components.

Applications

The ATS-18B-82-C3-R0 thermal heat sink is typically used as a way to disperse and dispel heat from components or equipment that are generating large amounts of heat. By guiding air over a larger surface area, the heat can be dissipated more quickly, allowing for more efficient cooling and improved product performance.Common applications for the ATS-18B-82-C3-R0 thermal heat sink include cooling fans, power supplies, medical diagnostic equipment, automotive engine cooling systems, appliances, IT and telecommunications equipment, and high-performance systems where space is a concern. It is also popular in the automotive and aerospace industries where its components can become significantly hot during operation.

Working Principle

The ATS-18B-82-C3-R0 thermal heat sink works by dissipating heat from hot components and using metal structures, air baffles, and finned surfaces to increase the surface area and therefore increase the amount of air that is moved past the heat sink. This increases the rate at which heat is taken away from the component and reduces the temperature of the component significantly. The combination of air movement and metal structure is designed to move air in an efficient manner, using the fins to further increase the rate at which heat is removed from the component.For efficient cooling, the air must be capable of moving through the fins. When air is moved past the heat sink, it transfers the heat away from the component and cools it. The speed of the air and the shape of the fins also make a difference in how much heat is removed. The faster the air moves, the faster heat can be removed from the component. The shape of the fins has an effect on how the air is moved past the heat sink and also affects the amount of heat transfer.

Conclusion

The ATS-18B-82-C3-R0 thermal heat sink is a versatile and powerful product that can be used in many situations. It is an optimal choice for cooling high-heat components in close spaces or power supplies. By combining metal structure, air baffles, and fins the ATS-18B-82-C3-R0 increases the surface area for more efficient cooling and air flow. This heat sink is an excellent choice for server farms, data centers, industrial manufacturing, and automotive cooling systems.

The specific data is subject to PDF, and the above content is for reference