ATS-18C-01-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-18C-01-C3-R0-ND

Manufacturer Part#:

ATS-18C-01-C3-R0

Price: $ 3.42
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18C-01-C3-R0 datasheetATS-18C-01-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.10779
30 +: $ 3.02379
50 +: $ 2.85566
100 +: $ 2.68771
250 +: $ 2.51975
500 +: $ 2.43576
1000 +: $ 2.18378
Stock 1000Can Ship Immediately
$ 3.42
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 22.05°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

Thermal - Heat Sinks are one of the most common forms of non-electric heat dissipation devices used for cooling. They are often used in high power electrical, electronic and motor installations to help spread heat evenly and to limit heating and reduce the operational temperature of equipment in operation. ATS-18C-01-C3-R0 is a heat sink model that is widely used in some applications. This paper provides information on the application field and working principle of the ATS-18C-01-C3-R0.

Application Field

The ATS-18C-01-C3-R0 is a universal heat-sink model that is designed for a wide range of applications, such as power amplifiers, switches, power supplies, high power LED assemblies, heat-generating electrical components and other applications that require efficient cooling. The model is typically used in applications that require operation in temperatures ranging from -55°C to 250°C, and is the ideal candidate for applications requiring high power dissipation.

Design and Structure

The ATS-18C-01-C3-R0 heat sink is constructed from an aluminum alloy material, which provides good thermal conductivity and great strength. The fins are also made up of the same material in order to ensure better heat dissipation. The ribbed fins are designed to spread heat over a large area and also help improve air flow. The ATS-18C-01-C3-R0 also features an integrated fan for additional cooling, which provides a significant increase in thermal efficiency.

Advantages

The ATS-18C-01-C3-R0 is an ideal choice for applications that require enhanced thermal performance. It features an optimum design that provides excellent thermal and electrical performance, which helps ensure high power dissipation and prevents over heating. The integrated fan also provides increased cooling efficiency to ensure that the temperature of the equipment does not reach high levels.

Working Principle

The working principle of the ATS-18C-01-C3-R0 thermal - heat sink is based on the concept of heat dissipation. Heat is generated when highpower electrical components are used and dissipated by energy transfer in the form of air or liquid. The ATS-18C-01-C3-R0 utilizes the concept of conduction, convection and radiation to facilitate efficient heat transfer from the component to the surrounding air. The design features a bridge design which helps improve thermal performance by reducing thermal resistance. The aluminum fins of the heat sink help transfer heat to the surrounding air by allowing the air to pass through the fin channels. The integrated fan helps to further increase the cooling performance of the device. The fan draws air through the fin channels, which helps to reduce the temperature of the air passing through the fins.

Conclusion

The ATS-18C-01-C3-R0 heat sink is one of the most popular thermal - heat sink models available today, and is commonly used in applications that require efficient cooling. It provides excellent thermal and electrical performance which helps to ensure that the device does not overheat. The integrated fan helps improve cooling performance, and the fins help to evenly spread heat over a large area. Furthermore, the bridge design helps reduce thermal resistance and prevents hot spots.

The specific data is subject to PDF, and the above content is for reference

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