| Allicdata Part #: | ATS-18C-02-C3-R0-ND |
| Manufacturer Part#: |
ATS-18C-02-C3-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18C-02-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23694 |
| 30 +: | $ 3.14979 |
| 50 +: | $ 2.97473 |
| 100 +: | $ 2.79972 |
| 250 +: | $ 2.62473 |
| 500 +: | $ 2.53725 |
| 1000 +: | $ 2.27478 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential in preventing electronic devices from temperature-related malfunctions. Heat Sinks, also known as thermal dissipaters, are designed to draw heat away from the source and into the surrounding air. The ATS-18C-02-C3-R0 is a heat sink specifically engineered for cost-effective and long-term applications.
The ATS-18C-02-C3-R0 is constructed of aluminum material and is built to exact specifications. It features a low profile design, with an offset copper base, which aids in the efficient dispersal of heat. The ATS-18C-02-C3-R0 is optimally constructed to provide heat transmission efficiency across a large quantity of devices in a densely populated space. The heat sink is capable of dissipating up to 30W of power.
The main purpose of the heat sink is to regulate the heat generated from electronics that are in operation. It acts as a means of thermal regulation by removing excess heat from the component, allowing it to operate efficiently at temperatures that are within the operating range provided. The base of the heat sink is designed to be positioned on a single surface, a feature which allows it to be securely and easily installed. In some cases, additional surfaces can be used to increase the amount of surface area available for thermal dissipation.
The working principle of the ATS-18C-02-C3-R0 is mainly based on the concept of thermodynamics. Thermal regulation, or heat transfer, works on the principles of conduction, convection and radiation. The base of the heat sink, made from copper, serves as a conduit for heat transfer. Heat from the source component is conducted to the copper base. The fins of the heat sink then act to disperse the heat away from the base and into the surrounding air. The fins also work to improve convection, which is the movement of air caused by the transfer of heat between solid objects.
Heat sinks are becoming an increasingly important component in the electronics industry. The ATS-18C-02-C3-R0 is uniquely optimized to provide cost-effective heating solutions for a range of applications. It is designed to provide an efficient and reliable thermal management system for extended operational life of electronic components.
The specific data is subject to PDF, and the above content is for reference