ATS-18C-10-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-18C-10-C1-R0-ND

Manufacturer Part#:

ATS-18C-10-C1-R0

Price: $ 3.61
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18C-10-C1-R0 datasheetATS-18C-10-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.28104
30 +: $ 3.19242
50 +: $ 3.01505
100 +: $ 2.83771
250 +: $ 2.66036
500 +: $ 2.57169
1000 +: $ 2.30565
Stock 1000Can Ship Immediately
$ 3.61
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.87°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management solutions are important in ensuring the proper functioning of many electronic devices. The ATS-18C-10-C1-R0 heat sink is a patented heat dissipating solution designed for use in applications requiring high efficiency thermal management. It features a specialized ribbed fin design and an integrated aluminum housing that provides superior cooling performance over traditional heat sinks.

The ATS-18C-10-C1-R0 heat sink utilizes a unique ribbed fin design which has been optimized to enhance thermal dissipation from the surface of the aluminum housing. This provides the device with exceptional cooling efficiency. Additionally, the ribbed design allows the heat sink to be mounted into tight spaces as needed.

The integrated aluminum housing is a key element of the ATS-18C-10-C1-R0 heat sink. This housing is designed to effectively disperse heat from the aluminum into the surrounding air. The aluminum housing is constructed using a special die-casting process for optimal strength and durability. Additionally, the heat sink design enables the easy and secure attachment of additional components or electrical connections, making it a versatile solution for many applications.

The working principle of the ATS-18C-10-C1-R0 heat sink is relatively simple. When the aluminum housing is heated, it radiates heat away from the device and into the surrounding air. In this way, the heat is dissipated away from the device and the internal components are protected from damage due to overheating. Additionally, the ribbed design of the fin enables the heat to be dissipated more quickly, improving the device’s cooling efficiency.

The ATS-18C-10-C1-R0 heat sink is a common solution for many types of electronics. It is especially suited for devices that require efficient thermal management, such as power amplifiers, LED drivers, gaming consoles, servers, and more. Additionally, this heat sink is designed to be durable and reliable, making it a perfect thermal solution for many applications.

In summary, the ATS-18C-10-C1-R0 heat sink is a specialized heat dissipating solution designed for use in applications requiring high efficiency thermal management. It features a unique ribbed fin design and an integrated aluminum housing that work together to provide superior cooling performance. Additionally, the working principle of the ATS-18C-10-C1-R0 heat sink is relatively simple, and it is commonly used in a variety of electronics requiring efficient thermal management. Therefore, the ATS-18C-10-C1-R0 is an ideal solution for many electronics applications that require effective temperature management and reliable operation.

The specific data is subject to PDF, and the above content is for reference

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