| Allicdata Part #: | ATS-18C-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-18C-10-C3-R0 |
| Price: | $ 3.89 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18C-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.53934 |
| 30 +: | $ 3.34257 |
| 50 +: | $ 3.14584 |
| 100 +: | $ 2.94928 |
| 250 +: | $ 2.75265 |
| 500 +: | $ 2.55602 |
| 1000 +: | $ 2.50686 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are electronic components usually made of metal, particularly aluminum, which aid in the dissipation of heat. They are used in a wide range of applications, from industrial automation to consumer electronics, to operate at higher temperatures than would be possible without them. One of the most common applications is the ATS-18C-10-C3-R0.
The ATS-18C-10-C3-R0 is a high-performance heat sink designed for the cooling of various electronic components, such as CPUs, GPUs, and power supplies. It is composed of an aluminum base plate, two fin stacks, and a die-cast aluminum housing, providing a total thermal resistance of 0.63°C/W. It has integrated mounting clips, allowing it to be easily attached to any form factor, and its design makes it suitable for a wide range of electronics cooling applications.
The key to the ATS-18C-10-C3-R0’s performance is its efficient dissipation of thermal energy. To aid in this, the heat sink is designed with several key features:
- High surface area – The base plate has a large surface area, which helps to quickly dissipate heat from the surface of the component. The fins also provide additional surface area for heat transfer.
- Airborne Heat – The fins provide a large surface area for convection cooling, allowing thermal energy to be dissipated to the surrounding environment.
- Fins Optimized for Performance – The fins are designed to be long to maximize the surface area for heat transfer, and are precision machined for optimal air flow.
- Low Thermal Mass – The heat sink is designed with a low thermal mass, which helps to quickly transfer heat away from the component.
In operation, the ATS-18C-10-C3-R0 works by transferring heat from the component’s surface to the fins. The fins then dissipate this thermal energy to the surrounding environment through convection cooling. The base plate also serves to transfer heat away from the component, and the aluminum housing helps to reduce air turbulence. The result is an efficient and effective cooling solution that helps to keep your electronics running cool and reliably.
The ATS-18C-10-C3-R0 is a reliable and effective solution for cooling the most demanding electronics. Its extensive surface area and efficient airflow ensure optimal heat transfer, while its low thermal mass allows for rapid cooling. Its design also allows for easy installation and integration into a variety of electronic applications. For these reasons, it is an excellent choice for anyone looking to ensure their electronics are running at peak performance, no matter the environment.
The specific data is subject to PDF, and the above content is for reference