ATS-18C-101-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.69°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-18C-101-C2-R0 Thermal - Heat Sinks

Thermal - Heat Sinks are important components used in electronic systems for its heat dissipation capability. Among the various heat sinks in the market, the ATS-18C-101-C2-R0 series of thermal - heat sinks is one of the most popular ones. This series of heat sinks is widely used in various industrial and household electronic products such as personal computers, communication transmitters, and medical equipments.The ATS-18 series of thermal - heat sinks has two variants, the C1 and the C2. The ATS-18C-101-C2-R0 is the C2 variant of this series. It is made from aluminum extruded sections with and coated with a matte black paint to give it a great look. This heat sink has long fins which helps in increasing the surface area of the heat sink and thus increasing its heat dissipation power. It also features a maximum air pressure of 2.5 inch H2O, a start up temperature of 60-70°C and a maximum operating temperature of 80-90°C.The ATS-18C-101-C2-R0 thermal - heat sink has great application fields in various electronic products. The applications can range from the consumer electronics such as computers and television sets to the industrial systems such as medical systems. The heat sink can be used to cool down the electronic components such as processors, hard drives, and graphics cards in the computers and television sets. It is also used to dissipate the heat from various industrial products such as medical laser systems.The working principle of the ATS-18C-101-C2-R0 thermal - heat sinks is quite simple. It works by using the cooling effect of convection for dissipating heat. When the electronic component generates heat, it is transferred to the heat sink through the components’ case. The heat then spreads over the fins of the heat sink causing air circulation between the fins. This forced air circulation helps in dissipating the heat quickly from the heat sink.The ATS-18C-101-C2-R0 thermal - heat sinks are designed to be low-profile and silent during their operations. This makes them ideal for use in many audio-video and multimedia products as well as medical equipments. Their low-profile design reduces the amount of space they require for installation in the products. This is an advantage as it leaves more room for other components in the electronic system.The ATS-18C-101-C2-R0 series of thermal - heat sinks is a great choice for cooling various electronic components in various products. Its wide range of applications, silent operation, and low-profile design make it a popular choice among many electronics and system designers. This series of heat sinks has earned the approval from many organizations and educational institutions for its reliable functioning. Thus, it is no surprise that it has become one of the most used thermal - heat sinks in the market.

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