ATS-18C-11-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	18.86°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Heat sinks are used for cooling electronic components and devices by dissipating heat generated by the device or system into the surrounding air and/or transferring it to a fluid medium. The ATS-18c-11-C3-R0 is a unique solution for the cooling of electronics and systems in limited space. This compact heat sink is specifically designed to respond to the demands of limited environmental space for components and systems operating at temperatures up to 395˚F. It provides high thermal efficiency and superior heat dissipation even in demanding applications.

Application Fields

The ATS-18c-11-C3-R0 heat sink is suitable for applications involving a wide range of heat-generating components and systems, such as high-power power regulators, high-efficiency power conversion electronics, lightening rods, electromechanical relays, high-output audio amplifiers, and any other devices that produce, dissipate, and manage heat.It is also used to cool small PCBs and other electronic components that feature tight spaces and limited air flow. Moreover, the ATS-18c-11-C3-R0 heat sink is suitable for aerospace, automotive, military, and industrial applications that require high levels of thermal performance.

Working Principle

The ATS-18c-11-C3-R0 heat sink relies on a closed loop system to operate effectively. The main components of this system include the heat sink itself, an aluminum fin array, and heat pipes that carry heat away from the fins.Heat pipes are hollow aluminum tubes that are filled with a special fluid that has a low boiling point. The heat from the fins is absorbed by the fluid, which then evaporates and travels to the other side of the heat pipe. The evaporated fluid is then condensed, releasing the heat into the air. This process allows the thermal mass to transfer energy at a higher rate then air can.The aluminum fins in the ATS-18c-11-C3-R0 are spaced evenly to maximize heat dissipation. The fin array is composed of extruded aluminum plates that are machined to produce straight fins in order to achieve maximum thermal performance. Furthermore, the fin array is designed to maximize the surface area of the heat sink and speed up the heat transfer process.

Conclusion

The ATS-18c-11-C3-R0 is an ideal solution for cooling a wide range of electronic components and systems in limited environmental space. This high-performance heat sink is designed with a closed loop system that features an aluminum fin array and heat pipes to efficiently dissipate heat away from the components. By using this technology, the ATS-18c-11-C3-R0 provides outstanding performance and high thermal efficiency even in demanding applications.

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