ATS-18C-117-C1-R0

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ATS-18C-117-C1-R0 application field and working principle

Heat sinks are devices that, in general, facilitate efficient cooling of electrical and electronic components by increasing the surface area to dissipate the generated heat. ATS-18C-117-C1-R0 is a kind of heat sink, which is mainly used for cooling processors, such as CPUs, on printed circuit boards. It is a ‘one-piece’ mini-tower heat sink, which is composed of an aluminium fin stack and a thermally-conductive plastic base. The base is rectangular in shape and is fitted with holes suitable for mounting the heat sink onto the printed circuit board.

The fin stack of this particular heat sink is composed of 18 layers, which have been curved into a ‘C’-shaped profile. The fins of this stack are 0.117 mm thick and are densely packed together, which helps to increase the area available to dissipate heat. Furthermore, the C shape of the fin stack minimises the risk of dust accumulation on the heat sink, as less of the fins are directly exposed to the outside environment.

The main purpose of ATS-18C-117-C1-R0 is to provide efficient cooling for processors by improving the flow of air over the surface of the device. The device exploits the principles of thermal convection, where air is heated inside the fins and is subsequently forced out, creating a low-pressure area. This low-pressure area then draws in air from the outside, forming a continuous cycle of air flow which, ultimately, helps keep the processor cool. The rate at which air is heated and forced out of the fins is helped by the shape of the fin stack, by generating an increased velocity compared to standard double-stacked heat sinks.

In addition to its thermal convection capabilities, the ATS-18C-117-C1-R0 uses a thermally-conductive plastic base to improve the thermal transfer of heat from the processor to the fins. The base of this particular heat sink has been designed to optimise the performance of the device at lower fan speeds, thus maximising overall efficiency. The plastic base is also designed to exhibit high thermal conductivity in order to improve the cooling performance at higher fan speeds. Furthermore, the plastic material of the base helps to reduce the amount of vibration generated by the fan.

This ‘one-piece’ mini-tower heat sink is also designed to be robust and reliable, and has been tested for resistance to corrosion and extreme temperatures. The fin stack of the ATS-18C-117-C1-R0 is able to withstand temperatures up to 120°C and also exhibits good performance in high-humidity conditions. As well as being impact-resistant, the device also ensures that the processor is well insulated and is therefore protected from dust and other contaminants.

The ATS-18C-117-C1-R0 is an ideal solution for providing reliable and efficient cooling of processors on printed circuit boards. Due to its small size and lightweight design, this heat sink is suitable for a range of applications, especially in compact enclosures. Additionally, its robust construction, together with its corrosion- and temperature-resistance, ensures that it will remain reliable in extreme conditions.

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