| Allicdata Part #: | ATS29998-ND |
| Manufacturer Part#: |
ATS-18C-121-C2-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18C-121-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.56580 |
| 10 +: | $ 3.47130 |
| 25 +: | $ 3.37756 |
| 50 +: | $ 3.18982 |
| 100 +: | $ 3.00220 |
| 250 +: | $ 2.81459 |
| 500 +: | $ 2.72077 |
| 1000 +: | $ 2.43931 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A heat sink is a device that transfers heat generated in an electronic component to the atmosphere. Heat sinks are commonly used in computers, laptops, tablets, and phones to transfer the heat generated by the components to the surrounding air, making it easier to dissipate the heat and keep the device cool. The ATS-18C-121-C2-R0 is a type of heat sink which is designed specifically for thermal management of electronic components. Here we will look at the application field and working principle of the ATS-18C-121-C2-R0.
The ATS-18C-121-C2-R0 is designed for applications where the ambient temperature is high, such as servers, networking, automotive, and industrial applications. It is designed to provide cooling performance in environments where the temperature can reach up to 85°C. The ATS-18C-121-C2-R0 is constructed from 6063-T6 extruded aluminum which is highly conductive and gives the heat sink high thermal efficiency. It is designed with a large surface area to provide more heat dissipation than other smaller heat sinks.
The ATS-18C-121-C2-R0 features a cylindrical shape with fins, which increases the surface area for dissipation of the heat. The fins act as a conductor and absorb the heat from the electronic components, transferring it to the air. The shape of the fins also allows for greater air circulation which improves the heat dissipation. The heat sink also features louvered air vents which further improve the air circulation and heat dissipation capability.
The ATS-18C-121-C2-R0 also features a stepped design, which creates a thermal buffer that allows it to maintain cooler temperatures even in high ambient temperatures. This is beneficial because the device can remain at a lower temperature even when the ambient outside is hot.
The ATS-18C-121-C2-R0 is designed to provide efficient thermal management of electronic components. It is constructed from highly conductive aluminum, which allows it to dissipate heat quickly and effectively. Its large surface area and stepped design allow for greater air circulation and improved heat dissipation. It is designed to work in high ambient temperatures, making it perfect for applications such as servers, networking, automotive, and industrial applications.
The specific data is subject to PDF, and the above content is for reference