ATS-18C-131-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS30009-ND

Manufacturer Part#:

ATS-18C-131-C2-R0

Price: $ 5.56
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X20MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18C-131-C2-R0 datasheetATS-18C-131-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 5.05260
10 +: $ 4.91589
25 +: $ 4.64285
50 +: $ 4.36968
100 +: $ 4.09658
250 +: $ 3.82347
500 +: $ 3.55036
1000 +: $ 3.48209
Stock 1000Can Ship Immediately
$ 5.56
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.60°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-18C-131-C2-R0 is a thermal-heat sink made by popular cooling solutions manufacturer Advanced Thermal Solutions. It is a state-of-the-art thermal-heat sink made from aluminum, featuring a unique design that is optimized for maximum cooling efficiency. The ATS-18C-131-C2-R0 is suitable for a wide range of application fields, including but not limited to computers, electronics, telecommunications, instrumentation, and more.

In general, thermal-heat sinks are designed to transfer heat generated from a computer or other electronic device to the surrounding environment. This is done by means of convective cooling. Convective cooling occurs when air (or other gases) passes over the fins or other flat surfaces of the thermal-heat sink, carrying heat away from the device and into the atmosphere. This process leads to improved cooling efficiency in the device, thereby reducing the risk of overheating.

The ATS-18C-131-C2-R0 is highly efficient in cooling down electronic components due to its unique design. Its aluminum construction is designed with a finned base plate and an integrated air channel, both of which aid in convective cooling. Its fins are angled in order to create more surface area for better air circulation, and the air channel helps to direct the air in a more efficient manner. Additionally, the thermal-heat sink is designed with a raised center core for improved air circulation. This design also offers more stability, thus increasing reliability.

The ATS-18C-131-C2-R0 is an example of an effective thermal-heat sink. It is designed to improve the performance of electronic components by cooling them more efficiently. It is a reliable and durable product, made from high-quality aluminum and featuring a unique and efficient design. Its fins are angled for maximum air circulation, and its air channel helps direct the air more efficiently. Additionally, its raised center core provides improved stability and reliability. The ATS-18C-131-C2-R0 is suitable for a wide range of application fields and is ideal for cooling down computers, electronic devices, instruments, and other components.

The specific data is subject to PDF, and the above content is for reference

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