| Allicdata Part #: | ATS-18C-159-C1-R0-ND |
| Manufacturer Part#: |
ATS-18C-159-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18C-159-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important priority in many industries, and the right heat sink can make a huge difference in an electronic system’s reliability and performance. The ATS-18C-159-C1-R0 heatsink is a perfect example—it combines features common to advanced thermal management solutions while remaining light, efficient, and reliable. This article will discuss the features, benefits, and applications of the ATS-18C-159-C1-R0 heatsink, as well as its working principle.
The ATS-18C-159-C1-R0 heatsink features a design that is both rigid and lightweight paired with fins that provide greater surface area. This combination of features provides superior performance in heat dissipation from compact outlets. The ATS-18C-159-C1-R0 features a thermal resistance of 0.9°C/W, providing efficient and reliable heat transfer. Additionally, the heatsink also features a detachable fan mount that allows for easy installation and disassembly.
The benefits of the ATS-18C-159-C1-R0 include its high thermal efficiency and easy installation. Its lightweight design makes it perfect for applications in which space is at a premium. The heatsink is also highly reliable, providing consistent and dependable performance over long periods of time. Its design allows for easy maintenance, and the detachable fan mount makes it easy to install and replace fans when needed.
The ATS-18C-159-C1-R0 is ideally suited for devices with high power requirements, such as processors, FPGAs, and other high-powered components. It can be used to cool systems with requirements of up to 300W of dissipated power. Additionally, the heatsink is also suitable for low-power, low-temperature applications, such as industrial automation and aerospace electronics, where thermoelectric cooling might usually be required.
The ATS-18C-159-C1-R0 works through conduction. Heat from a component is transferred via metal fins to the ambient air. The fin profile is designed to provide maximum surface area for heat transfer to the air. As the heat is dissipated into the air, it is replaced by cooler air which is pulled in by the fan and circulated through the fins. This cycle continues until the temperature of the component is reduced to an acceptable level.
In conclusion, the ATS-18C-159-C1-R0 heat sink is a reliable, efficient, and lightweight thermal management solution. It boasts high thermal efficiency and a lightweight design, making it ideal for applications in which space or weight is at a premium. Additionally, its thermal resistance of 0.9°C/W is more than adequate for applications with requirements up to 300W, while its detachable fan mount makes installation and maintenance a breeze. Finally, the ATS-18C-159-C1-R0 works by transferring heat from a component to the ambient air through metal fins, cooling the component in a continuous cycle.
The specific data is subject to PDF, and the above content is for reference