ATS-18C-17-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS30051-ND

Manufacturer Part#:

ATS-18C-17-C2-R0

Price: $ 4.56
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X12.7MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18C-17-C2-R0 datasheetATS-18C-17-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.13910
10 +: $ 4.02507
25 +: $ 3.80167
50 +: $ 3.57802
100 +: $ 3.35437
250 +: $ 3.13075
500 +: $ 2.90712
1000 +: $ 2.85122
Stock 1000Can Ship Immediately
$ 4.56
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.44°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks: ATS-18C-17-C2-R0 Application Field and Working Principle

Heat Sinks are solid objects made of metal or a combination of metal and plastic. Their purpose is to absorb heat from a hot object, usually an electrical component, to help cool it to prevent damage. They perform this function by dissipating the heat over a larger area. Heat sinks are usually attached to the electrical component with thermal tape or with screws or glue. The attachment is meant to allow air to circulate around the heat sink to improve the dissipation of heat.

ATS-18C-17-C2-R0 is an advanced thermal heat sink designed for applications like power electronics, telecommunications, and automotive electronics cooling. It features a highly efficient copper base and a wide variety of customizable aluminum fins and heat sink plates to ensure optimal cooling performance. It uses multiple pin connection types including spring clips and screw mounts for easy installation in any system. The copper base provides high thermal conductivity while the aluminum fins and heat sink plates provide higher thermal dissipation capabilities. With its wide variety of options, the ATS-18C-17-C2-R0 is suitable for a variety of cooling needs.

The working principle of the ATS-18C-17-C2-R0 is simple. Heat generated from the electronic component is first absorbed by the copper base and then transferred to the aluminum elements. The heat is then dissipated into the surrounding air through a combination of convection and radiation. The large area of the aluminum elements and the gap between them create an increased area for heat exchange between the component and the air. The increased thermal dissipation capability ensures efficient cooling of the component.

The ATS-18C-17-C2-R0 heat sink can be used in a variety of cooling applications. It is suitable for high-power components in telecom racks, datacenters, automotive and industrial electronics, and IT equipment. It is also widely used in consumer electronics like laptop coolers and gaming systems. Additionally, the heat sink can be configured to match the specific cooling requirements for components in any system.

In conclusion, the ATS-18C-17-C2-R0 heat sink is an efficient and reliable cooling solution for high-power components in various industries. Its customizable features enable it to match the specific cooling needs for any component. By efficiently dissipating heat away from the component, it can help to prevent overheating and reduce the risk of component damage or failure.

The specific data is subject to PDF, and the above content is for reference

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