ATS-18C-18-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-18C-18-C3-R0-ND

Manufacturer Part#:

ATS-18C-18-C3-R0

Price: $ 4.29
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X15MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18C-18-C3-R0 datasheetATS-18C-18-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.86001
30 +: $ 3.64539
50 +: $ 3.43098
100 +: $ 3.21653
250 +: $ 3.00208
500 +: $ 2.78764
1000 +: $ 2.73403
Stock 1000Can Ship Immediately
$ 4.29
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 13.45°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management products, such as thermal heat sinks, are a key component for any electronic system. In this paper, it is focused on the ATS-18C-18-C3-R0 thermal heat sink. This product is designed to dissipate heat generated by a wide range of power electronics, such as power transistors, TTL and CMOS circuits, and high current regulators.

The ATS-18C-18-C3-R0 thermal heat sinks are lightweight and have a small footprint. They are designed to provide efficient and reliable thermal management. The aluminum base is coated with a black powdercoat finish, which provides an attractive appearance and corrosion resistance. The flexible mounting brackets allow for easy installation on most systems, including DIN rails, chassis mounting, PCB assembly, and other mounting options.

The heat sinks are designed with an open-airframe design, providing maximum air flow through the unit. The heat sink can be configured with varying levels of thermal resistance, which enables the user to customize the performance. The fan-forced cooling technology enables the heat sink to dissipate heat quickly and effectively. This technology also provides the ability to control the temperature within the system by adjusting the speed of the fan.

The ATS-18C-18-C3-R0 thermal heat sink has a compact form factor, making it suitable for applications where space is limited. It is designed for use in applications with high power densities, such as power supply and motor control applications. The thermal heat sink is corrosion-resistant and can withstand temperatures up to 140 degrees C. The product is also rated for up to 1500 Watts of power.

In summary, the ATS-18C-18-C3-R0 thermal heat sink is a highly efficient and reliable thermal management product. The open-airframe design provides superior air flow, and the fan-forced cooling technology ensures effective cooling. It is suitable for high-power density applications, and has a corrosion-resistant coating. The product is rated for up to 1500 Watts of power and can handle temperatures up to 140 degrees C.

The specific data is subject to PDF, and the above content is for reference

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