ATS-18C-197-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-18C-197-C1-R0-ND

Manufacturer Part#:

ATS-18C-197-C1-R0

Price: $ 3.12
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X10MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18C-197-C1-R0 datasheetATS-18C-197-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.80539
30 +: $ 2.72979
50 +: $ 2.57809
100 +: $ 2.42645
250 +: $ 2.27480
500 +: $ 2.19898
1000 +: $ 1.97149
Stock 1000Can Ship Immediately
$ 3.12
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.86°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is essential for a variety of applications such as high-performance computing, automotive, aerospace, and consumer electronics. Heat sinks are used to dissipate the heat generated by electronics components, enabling them to function properly and at a consistent temperature. The ATS-18C-197-C1-R0 is a type of heat sink designed for use in a wide variety of applications, and it works through a simple yet reliable principle.

The ATS-18C-197-C1-R0 is a passively cooled heat sink, meaning that it does not require any external power source or active cooling system. It is made up of thin aluminum extruded sheets with specially engineered air flow channels to ensure improved thermal performance. It\'s designed to dissipate heat without air flow, and it also features a low-profile design for tight spaces. The heat sink can be easily mounted with thermal adhesive tape or other similar materials, and it can be installed in a variety of orientations.

The ATS-18C-197-C1-R0 operates by taking advantage of the natural convection of air. The thin aluminum sheets used to make the heat sink have a low thermal mass, meaning that they can absorb heat more quickly, and they also have a higher thermal conductivity, allowing the heat to move into the air more quickly. As the air is heated, it begins to rise due to buoyancy forces, causing a convection cycle within the aluminum sheet. This convection helps dissipate the heat more evenly across the surface of the heat sink, allowing it to more effectively work with the air flow to keep the temperature of the device below its critical threshold.

The ATS-18C-197-C1-R0 is a suitable option for a variety of applications. It can be used in consumer electronics such as computers, laptops, TVs, and consoles, as well as automotive, aerospace, and industrial applications. It is also well-suited for power supplies, power switching systems, power controllers, and logic circuits, as well as thermoelectric and other cooling applications.

The ATS-18C-197-C1-R0 is a reliable heat sink that can easily be mounted into place to efficiently dissipate heat in a variety of applications. It takes advantage of natural air convection forces to improve its overall performance, and its low-profile design makes it ideal for working in tight spaces. This heat sink is a great option for many different thermal management applications.

The specific data is subject to PDF, and the above content is for reference

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