| Allicdata Part #: | ATS-18C-210-C1-R0-ND |
| Manufacturer Part#: |
ATS-18C-210-C1-R0 |
| Price: | $ 5.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18C-210-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.78863 |
| 30 +: | $ 4.52256 |
| 50 +: | $ 4.25653 |
| 100 +: | $ 3.99055 |
| 250 +: | $ 3.72451 |
| 500 +: | $ 3.45848 |
| 1000 +: | $ 3.39196 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.17°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components for almost all modern electronics that operate at high temperature. Heat sinks are designed to dissipate heat away from sensitive and delicate electronic components, thus improving the performance and longevity of the device. The ATS-18C-210-C1-R0 is a unique heat sink with impressive thermal and electrical characteristics that make it ideal for many applications.
The ATS-18C-210-C1-R0 is a large, robust heat sink. Its extruded aluminum body measures roughly 18 inches by 12 inches, making it one of the largest heat sinks on the market. This size and weight make it ideal for applications that require large amounts of heat dissipation. The body itself is designed to provide efficient heat dissipation with an advanced fin array that allows for maximum contact between air and the hot body.
For electrical applications, the ATS-18C-210-C1-R0 also has impressive electrical properties. It features a low resistance per contact of 0.25 Ohms, making it suitable for applications with high current loads. The large contact area also makes it an excellent choice for applications where a uniform thermal performance is needed.
The ATS-18C-210-C1-R0 operates on the principle of convection. This heat dissipation is achieved by using airflow around the heat sink’s fins to cool the components inside the device. The fin array optimizes air flow to the hot body, allowing maximum transfer of heat energy. The air then flows out of the fins, taking the heat away from the device. This method is highly efficient, as it does not require additional energy to be consumed in order to cool the device.
The ATS-18C-210-C1-R0 is an excellent choice for many applications that require efficient cooling. It is highly suitable for LED lighting applications, as its low heat resistance and large contact area allows for efficient heat transfer. It is also excellent for applications that require a large, uniform temperature range, such as power supplies. The ATS-18C-210-C1-R0’s impressively robust build also makes it an ideal choice for industrial and industrial-grade applications, as it is able to resist extended temperatures and challenging conditions.
In summary, the ATS-18C-210-C1-R0 is an excellent thermal heat sink. It features an impressively robust body and highly efficient fins that allow for maximum dissipation of heat. The low resistance and large contact area make it suitable for many applications that require a large, uniform temperature range. Overall, the ATS-18C-210-C1-R0 is an excellent choice for many applications that require efficient thermal management.
The specific data is subject to PDF, and the above content is for reference