ATS-18C-24-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS30099-ND

Manufacturer Part#:

ATS-18C-24-C2-R0

Price: $ 5.97
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X20MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18C-24-C2-R0 datasheetATS-18C-24-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 5.37390
10 +: $ 5.22837
25 +: $ 4.93769
50 +: $ 4.64726
100 +: $ 4.35683
250 +: $ 4.06637
500 +: $ 3.77592
1000 +: $ 3.70330
Stock 1000Can Ship Immediately
$ 5.97
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.37°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal management is an essential part of many electronic and electrical systems, from industrial motor control to home electronics. Heat sinks are especially important because they transfer heat away from the components and help protect them from overheating. One such thermal management device is the ATS-18C-24-C2-R0, a rugged and reliable aluminum heat sink designed to dissipate heat from various components and conditions with its wide temperature range. The ATS-18C-24-C2-R0 is a widely used heat sink that offers excellent thermal performance as well as a low profile design.

The ATS-18C-24-C2-R0 is an optimized aluminum heat sink solution with an optimized fin design for maximum cooling efficiency. It is tailored to wide range electronic components operating in various environments and positions. This heat sink is designed to provide an up to 25°C temperature reduction from the output of the component. It is designed to resist wear and tear and is rated to operate in temperatures ranging from -40°C to +85°C while still providing reliable cooling.

The ATS-18C-24-C2-R0 features a 0.5 inch height profile to fit into tight spaces. Its narrow profile enables it to effectively dissipate heat in tight spaces while helping to prevent airflow restriction. It is flexible in design and can accommodate various form factors to meet the requirements of various system designs. The ATS-18C-24-C2-R0 is compatible with most components and is designed to resist corrosion and aging. The material used in this heat sink is a high-purity aluminum alloy with a special surface treatment forhigh resistance against oxidation or other environmental effects.

The ATS-18C-24-C2-R0 relies on air convection to dissipate heat from the components. This is accomplished by forcing air to flow over the fins of the heat sink. The fins themselves are shaped to maximize air flow while increasing surface area, thus dissipating more heat. The fins also help spread any heat buildup evenly, ensuring uniform cooling. This process allows the heat sink to effectively cool components such as microcontrollers and other circuit boards without the need for fans or any other active cooling device.

The ATS-18C-24-C2-R0 is widely used in both commercial and consumer electronic devices and is especially well-suited for applications in which a low profile and space limitations are a factor. It is designed for applications where the component temperatures might vary with environmental changes and is suitable for many applications including electric motor controls, appliances, safety equipment, telecommunication systems, and other devices.

The ATS-18C-24-C2-R0 is a reliable and versatile aluminum heat sink designed for wide range electronic components and conditions. It has an up to 25°C temperature reduction and is rated to operate in temperatures ranging from -40°C to +85°C while still providing reliable cooling. The ATS-18C-24-C2-R0 provides maximum cooling efficiency and protection to sensitive circuit components with its high-purity aluminum alloy with a special surface treatment for high resistance against oxidation or other environmental effects. It is an optimal solution for applications with space restrictions and when a low profile is desired. Its reliability and performance make it an ideal choice for thermal management in many different industries.

The specific data is subject to PDF, and the above content is for reference

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