| Allicdata Part #: | ATS-18C-50-C1-R0-ND |
| Manufacturer Part#: |
ATS-18C-50-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-18C-50-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-18C-50-C1-R0 application field and working principle
The ATS-18C-50-C1-R0 is an effective and efficient thermal heat sink for dissipating heat in a variety of mechanical and electrical applications. It can be used for a range of applications such as cooling of system components, temperature regulation, control of machine elements, and electrical power systems. Using high thermal conductivity aluminum-based alloys for optimal heat dissipation, the ATS-18C-50-C1-R0 can efficiently draw heat away from the heat source and help maintain the intended temperature.
The ATS-18C-50-C1-R0 can be used in a variety of applications such as computers, power systems, military applications, heat regulation and control systems, lighting, medical devices, consumer electronics, and commercial products. The most common application for the ATS-18C-50-C1-R0 is to dock and dissipate heat away from the sensitive components. The ATS-18C-50-C1-R0 features a large heatsink base for direct thermal contact with the heat source. The base is made of a high thermal conductivity aluminum alloy which draws heat away from the heat source, while the fins increase the surface area for further heat conduction away from the source.
The ATS-18C-50-C1-R0 is further enhanced through its unique heat dispersion pattern. This design ensures maximum cooling capacity is achieved when compared to traditional heatsink designs. The unique heat dispersion pattern of this thermal heat sink spreads the heat evenly throughout the complete heatsink surface area. As the heat dissipates across the radiating fins, it is further dispersed throughout the environment, creating an efficient and effective cooling effect.
The cooling effect delivered by the ATS-18C-50-C1-R0 is superior to other thermal heat sinks in its class. Its performance and cost effectiveness is unparalleled. The ATS-18C-50-C1-R0 is easy to install and provides superior cooling performance in any application. With its highly efficient thermal conductivity and efficient heat dispersion pattern, the ATS-18C-50-C1-R0 is an effective solution for any application requiring efficient thermal management.
Whether you are looking for improved cooling performance in an existing electronics system or something more efficient and cost-effective, the ATS-18C-50-C1-R0 thermal heat sink delivers superior performance and is an ideal solution for your application.
The specific data is subject to PDF, and the above content is for reference
ATS-18C-50-C1-R0 Datasheet/PDF