ATS-18C-55-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	24.11°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-18C-55-C3-R0 Thermal-Heat Sinks

Thermal-heat sinks are designed to dissipate heat, generally generated by electrical components, away from the component and into the surrounding air. They are commonly used to provide maximum airflow to parts of electronic devices and keep the environment cool, protecting components from damage. The ATS-18C-55-C3-R0 thermal-heat sink uses a combination of aluminum extrusion and aluminum or copper fins to dissipate large amounts of heat quickly and efficiently.

Applications

The ATS-18C-55-C3-R0 is a versatile thermal-heat sink that can be used in a variety of applications. It\'s ideal for cooling high-powered CPUs, GPUs, and other high-heat digital devices, as it provides excellent protection from overheating and helps to maintain performance at peak levels. It can also be used in industrial, medical, and automotive applications, as well as applications that require specialized thermal management.

Design Features

The ATS-18C-55-C3-R0 features a slim aluminum extrusion body that is designed to provide maximum surface area for heat dissipation. It also incorporates multiple aluminum or copper fins to help maximize airflow and increase heat dissipation. The extrusion body also incorporates a top-mounted fan to help remove hot air from the heat sink, allowing it to maintain optimum performance levels. Additionally, a special anodized finish helps to improve the heat sink\'s durability and ensures that it remains free of corrosion and other environmental contaminants.

Working Principle

The working principle of the ATS-18C-55-C3-R0 thermal-heat sink is relatively simple. Heat is generated by the electrical device or component and is dissipated through the aluminum or copper fins of the heat sink. The hot air is then removed by the top-mounted fan and the heat is dissipated into the surrounding air. This constant cycle of heat buildup, followed by dissipation, helps to ensure that parts are kept cool and their performance is not compromised.

Conclusion

The ATS-18C-55-C3-R0 thermal-heat sink is a versatile and reliable heat dissipation solution that can be used in a wide variety of applications. Its slim aluminum extrusion body and fin design offer excellent heat dissipation, while its top-mounted fan and anodized finish help to improve its lifespan. By combining efficient heat dissipation with durability, the ATS-18C-55-C3-R0 is an ideal choice for protecting high-powered digital devices from overheating.

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