| Allicdata Part #: | ATS-18C-58-C3-R0-ND |
| Manufacturer Part#: |
ATS-18C-58-C3-R0 |
| Price: | $ 3.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18C-58-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.49335 |
| 30 +: | $ 3.29931 |
| 50 +: | $ 3.10514 |
| 100 +: | $ 2.91110 |
| 250 +: | $ 2.71702 |
| 500 +: | $ 2.52293 |
| 1000 +: | $ 2.47442 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.25°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are essential to the proper functioning of many products, from large industrial systems to small electronic devices. The ATS-18C-58-C3-R0 heatsink is designed to provide reliable and efficient cooling for applications requiring maximum heat dissipation. This thermal product features an aluminum fin structure, flat base, and two fan mounting holes for easy integration with existing systems.
The ATS-18C-58-C3-R0 heatsink is constructed with an L-shaped fin profile that enables superior heat dissipation due to its large surface area and inherently low temperature approach. The aluminum fins are spaced apart typically allowing effective air circulation for enhanced cooling capacity, while the flat base ensures maximum contact with its attendant device for optimized heat conduction. The two fan mounting holes are suitable for most fan systems enabling easy installation and reliable operation.
The ATS-18C-58-C3-R0 heatsink provides outstanding thermal performance for applications requiring maximum heat dissipation. Its large surface area and low temperature approach ensures superior cooling capacity with minimized air turbulence. In addition, the flat base and fan mounting holes make this thermal product suitable for simple and efficient integration with existing systems. All in all, this heating device is perfect for applications requiring reliable and efficient cooling performance.
The working principle of the ATS-18C-58-C3-R0 heatsink is based on the principles of thermodynamics. Heat is generated during operation and is constantly dissipated by a process of conduction, convection, and radiation. Heat conducts from a hotter object (the device) to a cooler object (the heatsink). The fins of the heatsink act as a conductor, allowing the heat to transfer from the device to the surrounding air. The flow of air across the fins removes the heat by convection. Finally, radiation dissipates the heat energy away from the heatsink.
The ATS-18C-58-C3-R0 heatsink is most commonly used in industrial, home, and automotive applications. Its large fin area and fan mounting holes make it suitable for cooling small systems such as printers, computers, and office equipment, as well as medium to large systems like servers, power supplies, and vehicles. Moreover, its wide operating temperature range enables it to be used in environments routinely exposed to extreme temperatures.
In conclusion, the ATS-18C-58-C3-R0 heatsink is an excellent thermal product designed for applications requiring maximum heat dissipation. Its construction and features enable reliable and efficient cooling performance. The working principle is based on the principles of thermodynamics which facilitate the transfer of heat energy away from the temperature source. The ATS-18C-58-C3-R0 heatsink is suitable for industrial, home, and automotive applications and can handle extreme temperatures without compromising performance.
The specific data is subject to PDF, and the above content is for reference