
Allicdata Part #: | ATS30125-ND |
Manufacturer Part#: |
ATS-18C-62-C2-R0 |
Price: | $ 4.16 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 40X40X15MM L-TAB T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 3.78000 |
10 +: | $ 3.67794 |
25 +: | $ 3.47382 |
50 +: | $ 3.26957 |
100 +: | $ 3.06520 |
250 +: | $ 2.86086 |
500 +: | $ 2.65651 |
1000 +: | $ 2.60542 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.590" (15.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 16.48°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal heat sinks are cooling devices that dissipate heat from hot components. They are used in a variety of applications, including in computers, electronics, telecommunications equipment, and many other areas. The ATS-18C-62-C2-R0 heat sink is a thermal management solution specifically designed for high-power electronics. It is designed to dissipate heat generated in electronic components while also providing cooling and insulation, which helps to protect sensitive components from damage.
The ATS-18C-62-C2-R0 heat sink features a heat sink base made of extruded aluminum for maximum heat transfer. The heat sink base is also designed to reduce failure due to vibration. The top of the heat sink is made of anodized aluminum to protect it from corrosion. The heat sink fins are made of aluminum for enhanced heat dissipation. The thermal paste helps provide additional thermal transfer and prevents thermal buildup. Additionally, the heat sink features a fan-assisted cooling system to further improve cooling capabilities.
The ATS-18C-62-C2-R0 heat sink can be used in a variety of applications such as power supplies, telecommunication systems, gaming systems, and other high-power electronics. It is designed to provide maximum cooling efficiency to critical components. The heat sink’s design ensures that the components are kept cool and insulated from the environment, helping to protect them from damage. It is also designed to reduce noise, vibration, and thumping.
In order to understand how the ATS-18C-62-C2-R0 heat sink works, it is important to understand how heat is dissipated from an electronic component. Heat is created during the operational process of an electronic component, and if left unchecked, this heat can cause damage to the internal components. Heat is generated from the component and then transferred to the surrounding environment through thermal conduction. The heat then flows away from the component to the heat sink, and away from the heat sink to the environment. This process is known as heat dissipation.
The ATS-18C-62-C2-R0 heat sink is equipped with a fan to further facilitate heat dissipation. The fan works by drawing air through the heat sink and over the components, aiding in the dissipation process. The fan ensures that the air is always circulating to help dissipate the heat quicker and more efficiently. This enables the electronic components to remain cooler even when running at high power.
The ATS-18C-62-C2-R0 heat sink is designed to provide an efficient and reliable means of cooling electronic components in a variety of applications. Its combination of features ensure that it can dissipate heat quickly and reliably, helping to keep components running at optimal temperatures and improving their performance. Not only does it help keep components cool, but it also helps protect them from thermal-related failures and reduces noise, vibration, and thumping.
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