| Allicdata Part #: | ATS30133-ND |
| Manufacturer Part#: |
ATS-18C-70-C2-R0 |
| Price: | $ 4.97 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18C-70-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.51710 |
| 10 +: | $ 4.39551 |
| 25 +: | $ 4.15120 |
| 50 +: | $ 3.90701 |
| 100 +: | $ 3.66282 |
| 250 +: | $ 3.41863 |
| 500 +: | $ 3.17444 |
| 1000 +: | $ 3.11340 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.70°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Thermal - Heat Sinks are designed to increase the rate of heat dissipation. In general, these devices help maintain the temperature of other parts or components to safe levels. The ATS-18C-70-C2-R0 is a thermal-heat sink designed to cool down high temperature electronic components.
Application Field
The ATS-18C-70-C2-R0 is a high performance and reliable thermal-heat sink with a wide range of applications. It can be used in many areas such as industrial, commercial and medical applications, as well as many others. The device can be used to regulate the temperatures of a wide variety of components such as computers, lasers, LED’s, amplifiers, mobile communications equipment, microprocessors and various others. The device is suitable for both air and liquid cooling and can handle temperatures up to 4K.
Working Principle
The ATS-18C-70-C2-R0 is based on the principle of thermal conduction. It works by transferring heat from a hot component to a cold component. The device features an efficient power transfer system, with an 8-pole design, to provide greater heat dissipation. The device also features a copper base plate, which has a high thermal conductivity, to ensure efficient heat dissipation. The device is designed to fit within tight spaces and is easy to install. Additionally, the device is also UL certified and meets the highest safety standards.
Conclusion
The ATS-18C-70-C2-R0 thermal-heat sink is a highly reliable and efficient device for cooling high temperature electronic components. Its 8-pole design, copper base plate and UL certification makes it an ideal choice for industrial and commercial applications. The device is easy to install and is suitable for air and liquid cooling.
The specific data is subject to PDF, and the above content is for reference