| Allicdata Part #: | ATS-18C-80-C3-R0-ND |
| Manufacturer Part#: |
ATS-18C-80-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18C-80-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.19032 |
| 30 +: | $ 3.10380 |
| 50 +: | $ 2.93139 |
| 100 +: | $ 2.75902 |
| 250 +: | $ 2.58656 |
| 500 +: | $ 2.50034 |
| 1000 +: | $ 2.24169 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important consideration in many applications because excess heat can reduce the performance of systems and even cause them to fail prematurely. Heat sinks are very effective at removing heat from components by dissipating the heat to the air. A common type of heat sink is the ATS-18C-80-C3-R0, which is a physically small package with a short heat-transfer path and can dissipate a large amount of heat with a minimal amount of airflow.
The ATS-18C-80-C3-R0 heat sink is constructed of aluminum and has an anodized finish that helps protect it from environmental degradation. The heat sink consists of a rectangular body with a central extruded fin array, a large base, and a mounting bracket. The body is designed so that the external air flows into the fins and across the full surface area of the heat sink.
The heat sink includes a thermally conductive interface material between the device and the base of the heat sink to optimize thermal performance. This interface material provides a low thermal resistance between the device and the heat sink. In addition, the heat sink can be oriented to accommodate the airflow through the fins, so that the best possible thermal performance can be achieved.
The ATS-18C-80-C3-R0 heat sink is designed for use in applications with high power densities, such as in LED lighting, power supplies, and DC-DC converters. In these applications, it is important to effectively dissipate the heat generated by the components in order to maintain good performance and a longer life. The ATS-18C-80-C3-R0 heat sink is a very efficient way to keep components cool and running efficiently.
The ATS-18C-80-C3-R0 heat sink is designed to work efficiently with active airflow from a cooling fan. In order to achieve the best thermal performance, the fan should be oriented and adjusted to provide the best airflow. The heat sink can also be used without a fan, but the overall performance will be lower.
The ATS-18C-80-C3-R0 is a reliable and efficient thermal management solution for high power density applications. The short heat transfer path and large base, along with the thermally conductive interface material, provide excellent thermal performance. When used in conjunction with an active cooling fan, the ATS-18C-80-C3-R0 can keep components cool and running efficiently.
The specific data is subject to PDF, and the above content is for reference