ATS-18D-10-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.87°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal-Heat Sinks: ATS-18D-10-C1-R0 Application Field and Working Principle

Heat sinks are commonly used to dissipate heat away from sensitive components in electronic devices. They are extremely useful for reducing the internal temperature of electronic components, allowing them to run cooler and more efficiently. The ATS-18D-10-C1-R0 heat sink from AMP Thermal Products is a high-performance heat sink designed for various applications with maximum thermal performance and reliability. In this article we will discuss the application field and working principle of the ATS-18D-10-C1-R0 heat sink.The ATS-18D-10-C1-R0 heat sink has a wide range of applications. It is designed for use in industrial electronic equipment, automotive electronics, communication equipment, network equipment, computers and IT, healthcare, consumer electronics, and other electronics applications. This heat sink is ideal for use in embedded applications due to its small size, light weight, and high performance. It has a high thermal conductivity rating of 0.2 W/mK, which ensures efficient dissipation of heat.The ATS-18D-10-C1-R0 heat sink is designed with a pin grid array (PGA) design to ensure increased surface area and effective heat dissipation. The pins are made of aluminum to ensure efficient conduction of heat away from the component. The heat sink has a 7.6 mm high profile to provide maximum performance. The surface area of the heat sink is optimized to ensure maximum efficiency.The ATS-18D-10-C1-R0 heat sink works by dissipating heat away from the component. As heat is generated from the component, it is conducted through the pins of the heat sink. The pins are designed in a grid array pattern, which ensures that the heat is spread over as large an area as possible. The aluminum material of the pins also ensure efficient heat dissipation. The surface area of the heat sink is also optimized to improve heat dissipation. The high profile of the heat sink also ensures that the thermal performance is maximized. The heat generated by the component is then dissipated away from the heat sink into the ambient environment.The ATS-18D-10-C1-R0 heat sink is an excellent choice for use in embedded and electronic applications where maximum performance is needed. The pin grid array design provides increased surface area and efficient heat dissipation, while the optimized surface area ensures maximum performance. The material of the pins ensures efficient conduction of heat away from the component, and the high profile maximizes thermal performance. The heat generated by the component is efficiently dissipated away into the ambient environment, keeping the component relatively cool and running more efficiently.

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