ATS-18D-116-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.26°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-18D-116-C3-R0 thermal heat sink is an oriented heat expelling device designed to dissipate excess heat generated from a source, typically an electronic component or component assembly, into the ambient air. It is widely used in a variety of industries and for a number of different applications.

Design and Function

A thermal heat sink is typically composed of an array of metal fins arranged in a linear or curved fashion. Heat from the source is conducted to the metal fins where it is dissipated to the surrounding air. The fins act to increase the surface area of the sink, improving the rate at which excess heat is dispelled. The fins can also form air channels which help direct a steady flow of air over the heated surface area.The ATS-18D-116-C3-R0 has an external dimension of 18x116x(C3+R0)mm. Its compact size and low profile design makes it ideal for installations with limited space. It is constructed from aluminium alloy and features a black anodised finish which adds durability and strength to the sink. An array of 17 fins gives the sink a total surface area of 605cm2, aiding in the efficient dispelling of heat.

Application and Working Principle

The ATS-18D-116-C3-R0 is highly suitable for use in a variety of industries, due to its durability, high performance and compact size. It is most commonly used to dissipate heat generated from electronic components such as CPUs, GPUs, microcontrollers and amplifiers. It can also be used to cool power converters, motor and actuator controls, servo drives and other applications where heat buildup is an issue.The working principle of the ATS-18D-116-C3-R0 is relatively simple; heat generated from the source is conducted to the fins of the heat sink, where it is then dispersed to the surrounding air. As air passes over the fins, it absorbs the heat which reduces the temperature of the sink. This process is repeated until the source temperature is reduced to a safe operating level.

Conclusion

The ATS-18D-116-C3-R0 is a versatile and reliable thermal heat sink that is capable of dissipating high levels of heat generated from a variety of sources. Its compact size and low profile make it ideal for installations with limited space and its array of 17 fins provide adequate surface area for rapid heat dissipation. As such, it is suitable for use in a variety of industries and is suitable for cooling CPUs, GPUs, amplifiers and other electronic components.

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