ATS-18D-117-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.58°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

ATS-18D-117-C3-R0 thermal-heat sinks are commonly used in power electronic modules for managing heat. The thermal-heat sink is designed to effectively transfer thermal energy away from electronic components such as resistors, capacitors, and transistors. It functions by dissipating the heat through conduction, convection, and radiation, without requiring direct contact with the device. Heat is transferred away from the device and into the ambient air.

Operation Principle

When the electronic component generates heat, it is absorbed by the thermal-heat sink through the process of conduction. The aluminum body of the thermal-heat sink is a good thermal conductor, allowing the heat to travel from the component to the adjacent fins of the sink. The fins of the thermal-heat sink contain a large number of air passages and are designed to increase the overall surface area. This allows the heat to dissipate more quickly.

Once the heat has reached the fins, it is then dissipated through the process of convection. As the hot air rises due to buoyancy, the cooler air is pulled in from the bottom of the fins to create an airflow that is driven by the heat. This airflow is directed away from the electronic component and out into the ambient air to help cool the device.

The thermal-heat sink can also transfer heat through the process of radiation. The aluminum body of the thermal-heat sink acts as a radiator, emitting infrared radiation which travels through space and is absorbed by the surrounding objects. This radiation is also capable of transferring heat away from the electronic components and releasing it into the ambient air.

Design

The thermal-heat sink is designed to provide optimal heat transfer performance. The material of the sink is typically made up of extruded aluminum or copper with fins attached to the sides. The fins play an important role as they contain a large number of air passages which help to increase the overall surface area of the thermal-heat sink. This increase in surface area allows for more efficient heat transfer and helps to dissipate the heat more quickly.

The thermal-heat sink also utilizes a heat spreader technology which helps to spread the heat more evenly throughout the device. This allows for a more uniform heat distribution and helps to reduce the overall thermal resistance of the thermal-heat sink. The heat spreader technology also helps to improve the overall efficiency of the thermal-heat sink.

Conclusion

ATS-18D-117-C3-R0 thermal-heat sinks are designed to effectively transfer thermal energy away from electronic components. The sink utilizes conduction, convection, and radiation to dissipate the heat into the ambient air. The thermal-heat sink is designed with a large number of air passages which increase the overall surface area allowing for more efficient heat transfer. Additionally, a heat spreader technology is used to spread the heat more evenly throughout the device and improve the overall efficiency of the thermal-heat sink.

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