| Allicdata Part #: | ATS-18D-139-C1-R0-ND |
| Manufacturer Part#: |
ATS-18D-139-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18D-139-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.82933 |
| 30 +: | $ 2.75289 |
| 50 +: | $ 2.60001 |
| 100 +: | $ 2.44705 |
| 250 +: | $ 2.29408 |
| 500 +: | $ 2.21761 |
| 1000 +: | $ 1.98820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are essential for a variety of applications because they aid in stabilizing temperatures. Heat sinks, in particular, are highly efficient devices used to transfer heat from one medium to another in order to regulate temperatures. One such heat sink is the ATS-18D-139-C1-R0. This article will discuss the application field and working principle of this device to shed light on its unique features.
Application Field
The ATS-18D-139-C1-R0 is designed for applications that require high thermal efficiency for large power supplies or electronic devices. Its design makes it highly effective in transfer of heat from hot spots found on printed circuit board (PCB) components to a large area, such as a heat sink located away from the board. Additionally, it provides excellent flow characteristics for cooling fans, while still maintaining high thermal performance.
The heat sink is suitable for use in applications such as high-end computing, server farm and communications systems. It is also well suited for industrial applications, such as high-temperature test chambers, hot-press machines, reflow ovens and welders. The device can handle temperatures up to 200°C in environments with little or no airflow.
Working Principle
The ATS-18D-139-C1-R0 is an active heat sink, meaning that it uses a fan to cool the components within a system. The device relies on two primary components: a heat sink and a fan. The heat sink is designed to absorb heat that is generated by the components within the system, and it is made from aluminum with heat-conductive fins. These fins are designed to dissipate the heat by enhancing the surface area and accelerating airflow around the device.
The fan houses an impeller which is designed to draw air through the heat sink. This allows the heat from the components to be transferred to the heat sink, thereby cooling the components in the system. The shape and size of the impeller directly affects the rate of airflow and the resulting cooling efficiency. The ATS-18D-139-C1-R0 is optimized to provide efficient cooling and low power consumption by using a high performance impeller that is designed to ensure maximum airflow.
In addition to the fan, the device utilizes an electronic heat sensor that detects any changes in temperature. If the temperature exceeds a certain threshold, the sensor signals the fan to speed up and thereby increase the cooling performance. The ATS-18D-139-C1-R0 also features an integrated temperature control, which allows the device to control its temperature within a certain range. This helps to ensure the safety of the components within the system.
Conclusion
The ATS-18D-139-C1-R0 is a highly efficient heat sink designed for thermal management applications. Its active design makes it ideal for transferring heat from hot spots found on components and PCBs to large areas, such as heat sinks located away from the board. Additionally, its optimized fan and electronic heat sensor ensure efficient cooling and temperature control. This makes the device well suited for industrial, high-end computing, and server farm applications.
The specific data is subject to PDF, and the above content is for reference