| Allicdata Part #: | ATS-18D-147-C1-R0-ND |
| Manufacturer Part#: |
ATS-18D-147-C1-R0 |
| Price: | $ 3.37 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18D-147-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.05550 |
| 30 +: | $ 2.97276 |
| 50 +: | $ 2.80753 |
| 100 +: | $ 2.64235 |
| 250 +: | $ 2.47724 |
| 500 +: | $ 2.39466 |
| 1000 +: | $ 2.14693 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an essential part of thermal management, aiding in the dissipation of heat away from electronic components. The ATS-18D-147-C1-R0 is a unique example of this technology, integrating efficient size and cooling performance in a convenient surface-mount package. In this article, we will evaluate the application field and working principle of this particular heat sink.
The ATS-18D-147-C1-R0 is designed for cooling medium-size components. Its 17.27mm x 17.19mm footprint allows it to be positioned easily onto circuit boards, making it the ideal size for cellphone components and other similar applications. With its low profile of only 1.7mm high, it’s one of the slimmest sinks available. This makes it well-suited to dense, high-density layouts.
The ATS-18D-147-C1-R0 is capable of dissipating up to 6.8 watts of heat, at its maximum air flow rate of 4.8 CFM. This means that it’s effective at managing higher-power components, without the need for additional cooling components or fans. It also has a more heightened level of heat dissipation than equivalent-sized competitors, due to its thin profile and slim design.
The working principle of this thermal management solution is simple. Heat travels from the component to the heat sink via the principle of conduction. The aluminum fins on the heat sink are designed to increase the surface area of the component, allowing more heat to dissipate into the air. The increased air flow rate is also essential, as it helps to move the hotter air away from the surface of the component.
The ATS-18D-147-C1-R0 is also designed with an effective mounting system. It features two cutout holes for securing the heat sink to the PCB, using pre-attached screws. This ensures that the thermal efficiency of the heat sink remains consistent, while also being secure and efficient.
In summary, the ATS-18D-147-C1-R0 is an effective thermal management solution, designed for cooling medium-size components. Its efficient size and low profile allow it to be used in highly congested layouts, while its 6.8 watt dissipation rating ensures that it is able to handle higher power components. Its working principle is based on conduction and airflow, while its secure mounting system ensures that the thermal efficiency of the heat sink remains consistent and efficient.
The specific data is subject to PDF, and the above content is for reference