| Allicdata Part #: | ATS30235-ND |
| Manufacturer Part#: |
ATS-18D-157-C2-R0 |
| Price: | $ 4.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18D-157-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.10130 |
| 10 +: | $ 3.99042 |
| 25 +: | $ 3.76891 |
| 50 +: | $ 3.54715 |
| 100 +: | $ 3.32545 |
| 250 +: | $ 3.10376 |
| 500 +: | $ 2.88206 |
| 1000 +: | $ 2.82664 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks: ATS-18D-157-C2-R0 application field and working principle
When working with electronic components, there is a need for efficiently dissipating the heat generated by the components. Heat sinks are one of the most popular solutions for thermal management and in this article we will take a look at the ATS-18D-157-C2-R0 application field and working principle.
General Introduction
Heat sinks are highly efficient devices that are used to dissipate heat generated by electronic components. They are necessary to reduce the temperature of the component which can increase its working lifespan. As such, having an effective heat sink is important for maintaining the performance and lifespan of the component.
Working Principle
Heat sinks are designed to transfer heat from one component to another. This transfer of heat can be done via air, liquid or some other cooling medium. The working principle of a heat sink is based on the laws of thermodynamics and heat transfer.
When heat is generated from a component, it is transferred to the heat sink through conduction. From the heat sink, the heat is dissipated into the environment by a combination of convection and radiation. This transfer of heat is continuous even when the component is not generating heat.
Typical Features
The ATS-18D-157-C2-R0 has several features that make it ideal for use in a variety of applications. It features a standard aluminum construction with a black anodized finish. This gives it superior thermal conductivity and corrosion resistance. Additionally, it features a slim profile and is very lightweight, which makes it easy to install and remove when needed.
The ATS-18D-157-C2-R0 also features a minimum air gap of 0.4mm between the fins, which allows for increased cooling efficiency and performance. Additionally, its foamed plastic pad minimizes vibrations and resonances for effective noise reduction.
Applications
The ATS-18D-157-C2-R0 is best suited for applications that require an efficient cooling solution. It is often used in a variety of electronics, including power supplies, CPUs, video cards, and gaming consoles. It is also used in automotive applications, including fans and headlights.
The ATS-18D-157-C2-R0 is the perfect solution for any application that needs an efficient heat sink. Its lightweight and slim profile make it suitable for a wide range of installations, while its superior thermal conductivity and corrosion resistance make it ideal for long-term use.
Conclusion
The ATS-18D-157-C2-R0 is a highly efficient heat sink designed for use in a variety of applications. Its lightweight and slim profile allow for easy installation and removal when needed, while its increased cooling efficiency and noise reduction make it perfect for long-term use. With its superior thermal conductivity, corrosion resistance, and minimum air gap, the ATS-18D-157-C2-R0 is the perfect solution for any application that needs an efficient heat sink.
The specific data is subject to PDF, and the above content is for reference