| Allicdata Part #: | ATS-18D-173-C1-R0-ND |
| Manufacturer Part#: |
ATS-18D-173-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18D-173-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-18D-173-C1-R0 is a thermal solution designed specifically for use in a wide range of applications. The ATS-18D-173-C1-R0 is a highly efficient and reliable thermal solution which offers superior thermal management compared to alternatives and has the capability to dissipate large amounts of heat while also offering excellent reliability in higher temperature conditions.Thermal management involves the transfer and dissipation of heat in a system from a source to a target, and the use of various devices and materials to accomplish this transfer. Heat sinks are a type of thermal solution which handle the transfer of heat from a source to a target. The ATS-18D-173-C1-R0 is a type of heat sink, specifically designed for use in a variety of applications.The ATS-18D-173-C1-R0 heat sink is made of aluminum and has a maximum operating temperature range of 200°C. It has a high heat dissipation capacity of more than 250 W/K and a copper base which ensures good contact and excellent thermal conductivity. The heat sink has an optimized fin design for maximum performance and is coated with an advanced thermal interface material (TIM) to ensure efficient heat transfer. The ATS-18D-173-C1-R0 thermal solution is designed specifically for a variety of applications, including computers and servers, automotive electronics, and industrial electronics. The heat sink can be used to dissipate heat from various components, such as CPUs, GPUs, chipsets, RAM, and other components.The ATS-18D-173-C1-R0 heat sink is designed to work in conjunction with other thermal solutions, such as fan coolers, water blocks, and heat pipes. It can also be used in conjunction with active or passive fan systems, ensuring efficient cooling and optimal performance.A proper heat-sink installation is very important for the efficient operation of the heat sink. It is important that the heat sink is correctly positioned and mounted so that the heat generated by the components is dissipated efficiently. It is also important to install the heat sink in a system where there is sufficient air circulation to ensure that the heat from the components is dissipated quickly.The ATS-18D-173-C1-R0 heat sink is designed to be used in a variety of applications, offering excellent thermal management and reliable performance. It is an effective, reliable, and efficient thermal solution, and can be used in combination with other thermal solutions to ensure optimal performance in any system.
The specific data is subject to PDF, and the above content is for reference