| Allicdata Part #: | ATS-18D-197-C1-R0-ND |
| Manufacturer Part#: |
ATS-18D-197-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18D-197-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.80539 |
| 30 +: | $ 2.72979 |
| 50 +: | $ 2.57809 |
| 100 +: | $ 2.42645 |
| 250 +: | $ 2.27480 |
| 500 +: | $ 2.19898 |
| 1000 +: | $ 1.97149 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A Thermal-heat sink refers to a cooling device that absorbs, stores and disperses thermal heat. This technology is widely used in electronic products such as computers and cell phones. To ensure proper performance, product designers must consider the thermal properties of their product components and develop appropriate heat sinking solutions.
The ATS-18D-197-C1-R0 is one such thermal-heat sink solution. It is primarily used in the cooling process of semiconductor components. It is a compact, and versatile device that is designed for use in high power applications.
Application Field of ATS-18D-197-C1-R0
The ATS-18D-197-C1-R0 is applicable in various high-power applications such as computer notebooks, servers, LED lighting systems, projector systems, and more. It is also suitable for low-power applications such as consumer electronics and automotive electronics. This thermal-heat sink is designed to provide a robust and reliable cooling performance, while at the same time maintaining system efficiency.
Additionally, the ATS-18D-197-C1-R0 is designed to provide long-term and reliable system protection. This is achieved through its aluminum die-casting housing with protective surface coating. The device is also able to meet the requirements of a variety of applications with its wide range of sizes that can accommodate a variety of components.
Working Principle of ATS-18D-197-C1-R0
The ATS-18D-197-C1-R0 employs an advanced thermal-heat sink technology that is designed to draw heat away from components and disperse it efficiently. This is done by means of a thermally conductive metal that helps to hold heat away from the components, allowing for a more efficient and effective cooling performance. The metal helps to reduce the risk of system damage due to component overheating, thus ensuring reliable protection.
The device is designed to dissipate heat efficiently through an array of air fins that are attached to the body of the device. These air fins not only help to reduce the temperature of the device, but it also helps in increasing the surface area of the device, thus providing a greater cooling capacity. The air fins also aid in thecreation of an airflow that facilitates the collection and dispersal of heat away from the components.
Furthermore, the ATS-18D-197-C1-R0 is designed with an optimized thermal interface material that enables it to transfer and disperse heat effectively. This material helps in enhancing the performance of the device by ensuring a more efficient transfer of heat away from the components. Additionally, it is designed to reduce the system’s power consumption, thus allowing for a lower energy cost.
Conclusion
The ATS-18D-197-C1-R0 is a heat sink device that is designed to provide a reliable cooling performance that is required for various high-power, and low-power applications. It employs an advanced thermal-heat sink technology that allows for an efficient and effective cooling performance, while also ensuring system efficiency and reliability. Furthermore, it is designed with an optimized thermal interface material that helps reduce system power consumption, and improve the performance of the device. Therefore, the ATS-18D-197-C1-R0 is an effective and reliable thermal-heat sink solution for various applications.
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