| Allicdata Part #: | ATS30282-ND |
| Manufacturer Part#: |
ATS-18D-20-C2-R0 |
| Price: | $ 4.98 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18D-20-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.52970 |
| 10 +: | $ 4.40685 |
| 25 +: | $ 4.16203 |
| 50 +: | $ 3.91734 |
| 100 +: | $ 3.67246 |
| 250 +: | $ 3.42763 |
| 500 +: | $ 3.18280 |
| 1000 +: | $ 3.12159 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an important part of many electronic components. They serve to efficiently dissipate the heat generated by the component. Proper functioning of the component depends on the heat sink being capable of quickly absorbing and dissipating the generated heat. The ATS-18D-20-C2-R0 is a high quality heat sink suitable for use with high frequency circuits with large dissipating components.
The ATS-18D-20-C2-R0 heat sink is made of aluminum and is a flanged fin-type design. The fins are extended or tightly spaced as desired for the application, providing a wide variety of sizes for heat dissipation. Additionally, the heat sink\'s surface has undergone a high temperature anodizing process that provides protection against corrosion and extends its service life. The ATS-18D-20-C2-R0 also features an integrated adiabatic thermal bridge which enables efficient transmission of the generated heat into the heat sink\'s fins.
The ATS-18D-20-C2-R0 can be used in a variety of applications, such as telecommunications, power supplies, and computer components. It is also suitable for use with high power transistors, IGBTs, and other high frequency components that dissipate large amounts of heat. It is designed to dissipate heat quickly and efficiently, keeping the temperature of the component within the safe operating range.
The working principle of the ATS-18D-20-C2-R0 is based on convective and conductive heat transfer. Heat generated by the component is transferred to the heat sink\'s fins via a thermal bridge, where it is then dissipated through convection. The convection is facilitated by the fins, which create a high surface area-to-volume ratio. This enables the heat to spread quickly throughout the heat sink, ensuring that it is dissipated efficiently across the entire surface.
Heat sinks such as the ATS-18D-20-C2-R0 are essential components in many electronic devices, as they provide critical cooling solutions that prevent the component from overheating. Furthermore, the ATS-18D-20-C2-R0’s lightweight construction and easy installation make it an ideal choice for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference