ATS-18D-20-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.21°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are a type of technology designed to disperse and distribute heat away from a device or component. The ATS-18D-20-C3-R0 heat sink is a powerful and efficient way to reduce the temperature of a given device or component. Here, we will discuss the application field and working principle of the ATS-18D-20-C3-R0.The ATS-18D-20-C3-R0 is ideally suited for use in high temperature, high power applications. It is specifically designed for efficient heat dissipation and distribution with an optimized fin design. It is a great option for devices or components that generate high amounts of heat, such as power transistors, high power thyristors, and high power insulated-gate bipolar transistors (IGBT). The heat sink also has an impressive C/W ratio which further enhances its ability to disperse heat quickly and efficiently compared to traditional heat sinks. The working principle of the ATS-18D-20-C3-R0 is based on the principle of thermodynamics, specifically the three laws of thermodynamics. The heat sink works by transferring heat away from a given device or component and into the surrounding environment. This is done through a combination of convection, conduction and radiation. First, the heat sink makes use of the principles of convection and conduction to dissipate heat away from the device or component. Convection works by moving warm air away from the device or component and then into the surrounding environment, while conduction is the direct transfer of heat from one substance to another through physical contact. By making use of both of these principles, the ATS-18D-20-C3-R0 is able to quickly and efficiently transfer heat away from the device or component, greatly reducing its operating temperature. The heat sink also uses the principle of radiation to transfer heat away from the device or component. Radiation works by emitting infrared radiation in the form of light, which is then absorbed by the surrounding environment. This is especially effective in low temperatures and environments where convection and conduction are ineffective. Finally, the ATS-18D-20-C3-R0 is also designed with an optimized fin design, which further enhances its ability to effectively and efficiently transfer heat away from the device or component. The fins are designed to have a high surface area, which maximizes the heat dissipation potential of the heat sink. Fin design is an important factor in determining the efficiency of a heat sink, as it impacts the amount of air flow and the heat dissipation potential.The ATS-18D-20-C3-R0 heat sink is a powerful and efficient way to reduce the temperature of a given device or component. It is an ideal choice for applications requiring heat dissipation and efficient distribution due to its optimized fin design, impressive C/W ratio, and its ability to make use of thermodynamic principles such as convection, conduction, and radiation. With all these features combined, the ATS-18D-20-C3-R0 is well suited for high temperature, high power applications and can help improve the overall performance of a given device or component.

The specific data is subject to PDF, and the above content is for reference