| Allicdata Part #: | ATS-18D-28-C3-R0-ND |
| Manufacturer Part#: |
ATS-18D-28-C3-R0 |
| Price: | $ 7.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18D-28-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.73218 |
| 30 +: | $ 6.35796 |
| 50 +: | $ 5.98387 |
| 100 +: | $ 5.60990 |
| 250 +: | $ 5.23590 |
| 500 +: | $ 4.86191 |
| 1000 +: | $ 4.76841 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.62°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is very important in today’s electronic devices. In order to control the temperature and enhance the performance of the device, extensive thermal management research and development has been conducted in the industry. Nowadays, the use of heat sinks has become a popular solution for the thermal management of electronic devices. ATS-18D-28-C3-R0 is one of the most popular heat sinks in the market.
ATS-18D-28-C3-R0 is an aluminum based heat sink with an attractive thermal design. The heat sink features a compact design as compared to other heat sinks of its size, and has a simple but robust construction. It consists of 18 cooling fins and 28 heat exchangers, with a total thermal resistance of 0.03K/W. The heat exchangers are designed to have high thermal efficiency, and the cooling fins have an effective area of 18mm, which helps in dispersing the heat.
This heat sink is suitable for many applications, including LED lighting, server cooling, power supplies, and power electronics. It is well suited for applications where space is a concern, as it occupies very little space. This heat sink also works well in smaller enclosures, as it can fit in tighter spaces. It is especially useful for applications that require high power with a small form factor.
The working principle of ATS-18D-28-C3-R0 heat sink is simple. It conducts the heat generated by the source (usually the electronic device) to the cooling fins, which then dissipate the heat to the surrounding environment. The working of the heat sink is based on the principle of conduction. It takes advantage of the temperature gradient between the source and the surrounding environment to transfer the heat. The heat exchanger helps in transferring the heat from the source to the fins, which improves the efficiency of the heat dissipation.
ATS-18D-28-C3-R0 heat sink is a reliable and highly efficient thermal solution for many different applications. It is designed to have a high thermal efficiency, and its robust construction can withstand even the toughest conditions. Its small form factor makes it suitable for applications that require high power in a small space, while still providing effective cooling. Its simple construction and working principle make it ideal for many different applications, and it is an excellent choice for thermal management.
The specific data is subject to PDF, and the above content is for reference