ATS-18D-38-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-18D-38-C1-R0-ND

Manufacturer Part#:

ATS-18D-38-C1-R0

Price: $ 5.58
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 36.83X57.6X22.86MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18D-38-C1-R0 datasheetATS-18D-38-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.01984
30 +: $ 4.74117
50 +: $ 4.46216
100 +: $ 4.18333
250 +: $ 3.90444
500 +: $ 3.62555
1000 +: $ 3.55582
Stock 1000Can Ship Immediately
$ 5.58
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 1.450" (36.83mm)
Width: 2.267" (57.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.900" (22.86mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.40°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-18D-38-C1-R0 heat sink is an excellent choice for controlling thermal and heat transfer in wide range of applications. It is a special type of heat sink that features a compact design with a long length and a narrow width. The design makes it ideal for applications that require extreme temperatures or require higher cooling performance than the standard aluminum fins.

The ATS-18D-38-C1-R0 is composed of a base plate, a heatsink, a thermoelectric module, and support brackets. The base plate is made of thick aluminum and provides excellent heat dissipation and thermal transfer. The heat sink contains multiple thin fins, each of which can be custom-designed to best fit the applied application. The thermoelectric module converts electric energy into thermal energy and dissipates heat away from the temperature control device.

The ATS-18D-38-C1-R0 thermal-heat sink has several advantages compared to standard aluminum fins or other thermal-heat sinks. It has higher thermal conductivity and heat dissipation capacity as well as superior cooling performance. Furthermore, the narrow design of the heat sink allows for thinner, yet more efficient heat exchange, which optimizes its heat removal capabilities. It also reduces weight, space consumption and makes designs more compact.

In terms of its application fields, the ATS-18D-38-C1-R0 thermal-heat sink is primarily used in industrial settings such as factories, hospitals, research facilities and more. Its exceptional heat dissipation and cooling performance makes it ideal for controlling temperatures in extreme conditions. For example, applications such as computer servers, lasers, medical imaging, and HVAC units will all benefit from the improved efficiency of this heat sink.

In terms of its working principle, the ATS-18D-38-C1-R0 heat sink uses a variety of techniques to control and dissipate the heat generated. The aluminum base plate provides excellent thermal conductivity through which the heat is quickly transferred from the device to the fins. The fins are then able to dissipate the heat away from the device, providing excellent cooling performance.

In conclusion, the ATS-18D-38-C1-R0 thermal-heat sink is an ideal choice for controlling thermal and heat transfer in a wide variety of applications. Its high-performance design allows for superior cooling with improved thermal efficiency and energy savings. Additionally, its compact profile reduces weight and space consumption, making it a cost-effective and efficient alternative to traditional aluminum fins.

The specific data is subject to PDF, and the above content is for reference

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