| Allicdata Part #: | ATS-18D-59-C3-R0-ND |
| Manufacturer Part#: |
ATS-18D-59-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18D-59-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-18D-59-C3-R0 is a type of thermal - heat sink device at the forefront of modern cooling technology. It is designed for a variety of applications: from chip cooling to server drying, and even providing chilling on the lower floors of multi-story buildings.
The ATS-18D-59-C3-R0 achieves high levels of cooling performance through its innovative heat sink design. It features a highly effective, patented combination of aluminum and copper to efficiently draw heat away from its designated area. The aluminum is further arrayed to create a large surface area to maximize its heat capacity. These features allow heat to be quickly dispersed and drawn away, keeping its area at a much lower temperature.
The ATS-18D-59-C3-R0 is a unique device in that it does not require any mechanical components beyond its heat sink surface. Instead, the device is self-sufficient, utilizing convection-based cooling to keep its designated area at a desirable temperature. The combination of its light-weight design and efficient cooling capabilities make the ATS-18D-59-C3-R0 a perfect cooling solution for a variety of applications.
The ATS-18D-59-C3-R0 is designed to efficiently draw heat away from its intended area. The cunning use of aluminum effectively dissipates the heat, allowing for a rapid cooling effect. The device is then attached to a thermoelectric cooler; as the cooler draws in cold air, the heat is exhausted outward. This cold air is then distributed throughout its designated area, cooling to optimal temperatures.
The ATS-18D-59-C3-R0 has a wide variety of applications, ranging from chip cooling, server drying, and temperature control in multi-story buildings. For chip cooling, its lightweight design makes it an ideal choice for tight spaces such as multi-processor motherboards. For server drying, it can quickly absorb and exhaust large amounts of thermal energy due to the massive surface area of its heat sink. Its capacity to quickly regulate multiple temperature zones makes it a perfect choice for large multi-story buildings.
The ATS-18D-59-C3-R0 is a state-of-the-art cooling solution that is designed to efficiently draw away heat from its intended area. Utilizing a combination of aluminum and copper heat sinks, the device is able to quickly and effectively dissipate heat without any mechanical components. Its lightweight design allows it to easily be installed in almost any application, ranging from chip cooling to server drying. The ATS-18D-59-C3-R0 is an ideal cooling solution for any application.
The specific data is subject to PDF, and the above content is for reference