| Allicdata Part #: | ATS30327-ND |
| Manufacturer Part#: |
ATS-18D-66-C2-R0 |
| Price: | $ 4.97 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X35MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18D-66-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.51710 |
| 10 +: | $ 4.39551 |
| 25 +: | $ 4.15120 |
| 50 +: | $ 3.90701 |
| 100 +: | $ 3.66282 |
| 250 +: | $ 3.41863 |
| 500 +: | $ 3.17444 |
| 1000 +: | $ 3.11340 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.77°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management has become an increasingly important consideration in electronic device designs. Heat sinks are one of the most popular thermal management solutions, and the ATS-18D-66-C2-R0 is a particular model that offers a unique combination of features for enhancing the longevity of electronic circuitries and other components. In this article, the application field and working principle of the ATS-18D-66-C2-R0 heat sink will be discussed.The ATS-18D-66-C2-R0 is a heat sink designed for small to medium-sized devices. Its low profile design and patented pin structure make it ideal for space-constrained installations, ensuring that air can flow freely among the pins for optimal thermal efficiency. The heat sink also features an optimized dielectric structure that allows it to effectively dissipate heat from a broad range of electronic components without compromising the board layout.In terms of application field, the ATS-18D-66-C2-R0 heat sink is suitable for use in a wide range of industrial applications. It is commonly used in power electronics, LED lighting, automotive applications, medical devices, and telecommunications systems. With its superior thermal efficiency and durable dielectric construction, the ATS-18D-66-C2-R0 offers reliable protection for sensitive electronics exposed to high operating temperatures.The working principle of the ATS-18D-66-C2-R0 heat sink is simple but highly effective. The heat sink consists of an array of pins that are made of an aluminum alloy. These pins are designed to promote the flow of air around their surfaces, providing a higher rate of convection heat transfer. This helps to quickly draw heat away from electronic components and dissipate it into the surrounding air.The heat sink also features a patented dielectric structure that helps to reduce the overall thermal resistance of the heat sink. The structure works to reduce the thermal resistance of the pins by allowing air to flow more freely around the pin surfaces. The dielectric structure also provides additional benefits such as improved corrosion resistance and longer life expectancy.In conclusion, the ATS-18D-66-C2-R0 is a highly reliable and efficient heat sink suitable for use in a wide range of industrial applications. It features an optimized dielectric structure and patented pin design that facilitate the efficient dissipation of heat from sensitive electronic components. The heat sink is also durable and resistant to corrosion, making it a reliable choice for long-term installations.
The specific data is subject to PDF, and the above content is for reference