ATS-18E-02-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-18E-02-C1-R0-ND

Manufacturer Part#:

ATS-18E-02-C1-R0

Price: $ 3.20
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X12.7MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18E-02-C1-R0 datasheetATS-18E-02-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.91249
30 +: $ 2.83395
50 +: $ 2.67649
100 +: $ 2.51899
250 +: $ 2.36157
500 +: $ 2.28284
1000 +: $ 2.04668
Stock 1000Can Ship Immediately
$ 3.2
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.29°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an important factor for the efficient and safe operation of many electronic devices. Heat sinks are common thermal solutions for cooling electronics and are used in everything from computer fans to data centers and more. The ATS-18E-02-C1-R0 is a type of heat sink that can be used in a wide range of applications and offers excellent performance when it comes to dissipating heat.

The ATS-18E-02-C1-R0 is an aluminum heat sink that measures 18 mm x 18 mm x 10 mm. It is designed to be mounted onto a PCB or substrate, and uses an aluminum alloy that is resistant to corrosion and can stand up to high temperatures. The main purpose of the ATS-18E-02-C1-R0 is to transfer heat away from sensitive components on the board and dissipate it into the surrounding environment.

To ensure that heat is effectively dissipated, the ATS-18E-02-C1-R0 is designed with a dozen individual fins. These fins create a greater surface area for heat exchange, which helps to reduce the temperature of the board. The fins are connected with a thermal bonding region, which helps to keep the heat gains from one section from effecting the other sections.

The ATS-18E-02-C1-R0 can be used in a variety of applications, including audio and video equipment, telecommunications equipment, and computer systems. It can also be used in automotive and medical applications, as well as commercial and industrial applications. The heat sink can also be used in applications that require high thermal performance, such as in the aerospace industry.

The ATS-18E-02-C1-R0 has a variety of features that make it well-suited for any application. For instance, it has a light weight that allows for easy installation, and its thermal conductivity is extremely high, making it the perfect choice for efficiently transferring heat away from sensitive components. Additionally, its small size makes it ideal for applications where space is at a premium.

The ATS-18E-02-C1-R0 also features an enclosed design that helps to keep dirt, dust, and other debris out of the heat sink and thus increases its life. The heat sink is resistant to corrosion and is able to withstand temperatures of up to 200°C, which makes it suitable for use in a wide range of environments.

The ATS-18E-02-C1-R0 is an excellent solution for anyone looking to improve the cooling performance of their electronic equipment. Its small size and lightweight design make it ideal for applications where space is at a premium, and its high thermal performance makes it the perfect choice for applications requiring efficient heat transfer. With its corrosion resistance and temperature resistance, the ATS-18E-02-C1-R0 is an ideal heat sink for any application.

The specific data is subject to PDF, and the above content is for reference

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