ATS-18E-12-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-18E-12-C1-R0-ND

Manufacturer Part#:

ATS-18E-12-C1-R0

Price: $ 3.48
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X12.7MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18E-12-C1-R0 datasheetATS-18E-12-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.16197
30 +: $ 3.07671
50 +: $ 2.90581
100 +: $ 2.73489
250 +: $ 2.56397
500 +: $ 2.47851
1000 +: $ 2.22211
Stock 1000Can Ship Immediately
$ 3.48
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.84°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management has become an increasingly important aspect of industrial and commercial operations. Companies are often looking for ways to reduce energy costs and increase the efficiency of their equipment. The ATS-18E-12-C1-R0 is a thermal heat sink device that is used to both heat and cool components and equipment. It is designed to work with a variety of applications including industrial, commercial and residential sectors. This article will discuss the application field and working principle of the ATS-18E-12-C1-R0.

The ATS-18E-12-C1-R0 heat sink is designed to provide various levels of cooling and heating abilities. This device works by transferring heat from one object to another, thus improving the temperature control of a component or system. It is commonly used in applications where high and/or low temperatures are required, such as in computer hardware, industrial machinery, solar panel systems and automotive applications.

The ATS-18E-12-C1-R0 has a simple working principle. It includes two main components, the absorber plate and the radiator plate. The absorber plate absorbs heat from the object, and then the heat is transferred to the radiator plate. The radiator plate then dissipates the heat to the ambient environment. This allows for better temperature control of the object and allows for more efficient use of energy.

The ATS-18E-12-C1-R0 is made up of three layers. The first layer is called the absorber plate which is composed of aluminum and other metals. This plate is designed to absorb the heat from the object and then transfer it to the second layer. The second layer is the radiator plate, which is composed of copper particles. This layer is responsible for dissipating the heat away from the object. The third layer is the enclosure, which is made of plastic or metal and houses the components of the heat sink.

The ATS-18E-12-C1-R0 has several advantages over other thermal management solutions. It is a highly efficient solution for cooling large components and systems. It has a fast cooling rate and can be easily installed into existing equipment. Additionally, the ATS-18E-12-C1-R0 is capable of achieving extremely high temperatures and, when combined with passive radiators, can be used to successfully reduce the internal temperature of a system or component.

The ATS-18E-12-C1-R0 is also highly cost-effective. It is very easy to install and maintain, making it an affordable solution for both commercial and residential applications. Additionally, it is relatively easy to customize the device to meet the specific requirements of a particular application.

In conclusion, the ATS-18E-12-C1-R0 heat sink is an effective and cost-effective solution for cooling and heating components and systems. It has a simple working principle, which makes it easy to install and maintain. Additionally, the device is capable of cooling to high temperatures and is highly efficient in cooling large components. This makes it an ideal solution for a variety of industrial, commercial and residential applications.

The specific data is subject to PDF, and the above content is for reference

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