ATS-18E-12-C3-R0

Thermal - Heat Sinks

The ATS-18E-12-C3-R0 is a type of thermal control device known as a heat sink. It is a device designed to absorb and dissipate heat away from a heat source such as a CPU. In many cases, it is used to help protect a sensitive component from overheating. Heat sinks are usually composed of a metal base with a finned arrangement on top, which allows for increased surface area. Heat is then drawn away from the components of the device and dissipated into the air. Heat sinks are typically used in combination with a fan to help control the temperature of a device, typically in order to prevent overheating.

The ATS-18E-12-C3-R0 is an aluminum heat sink designed for use in a variety of general-purpose applications. It has a finned surface area of 12 square inches, with a base plate of 3.3 mm thick, providing a maximum dissipation area of up to 18 inches. It is rated for up to 1000 Watts of dissipation and uses a standard four-pin fan system. It is compatible with all Intel and AMD CPUs.

The working principle of the ATS-18E-12-C3-R0 can be broken down into two main steps. The first step is the absorption of heat from the heat source. This is accomplished by transferring the heat energy from the heat source to the heat sink through thermal conduction, which is achieved through a combination of the metal base and the finned arrangement on top. The finned arrangement on the top allows for increased surface area, which allows for more efficient heat transfer away from the component.

The second step is the dissipation of heat away from the heat sink. This is achieved through a combination of convection and radiation. Convection is the process of air flow around the heat sink dissipating the heat away from the fins and into the surrounding air. Radiation is a process of the heat energy from the fins being released in the form of infrared light and dissipated into the air.

In summary, the ATS-18E-12-C3-R0 is a thermal control device used to absorb and dissipate heat away from a heat source such as a CPU. It is composed of a metal base with a finned arrangement on top, which increases surface area making for efficient heat transfer. Heat is then drawn away from the component and dissipated into the air. The heat sink is rated for up to 1000 Watts of dissipation and is compatible with all Intel and AMD CPUs. The working principle of the ATS-18E-12-C3-R0 involves combining thermal conduction, convection, and radiation to efficiently transfer heat away from the component, ultimately preventing overheating.