| Allicdata Part #: | ATS-18E-144-C1-R0-ND |
| Manufacturer Part#: |
ATS-18E-144-C1-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18E-144-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.19788 |
| 30 +: | $ 3.11157 |
| 50 +: | $ 2.93857 |
| 100 +: | $ 2.76576 |
| 250 +: | $ 2.59291 |
| 500 +: | $ 2.50647 |
| 1000 +: | $ 2.24717 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is one of the most important considerations in the design and building of computer systems. Heat sinks, such as the ATS-18E-144-C1-R0, are an important part of the cooling process. By dissipating heat generated by the system, these devices help ensure that components stay within their peak thermal performance levels.
ATS-18E-144-C1-R0 Application Field
The ATS-18E-144-C1-R0 heat sink is designed primarily for use in consumer PCs, although it may also be suitable for some applications in enterprise-level servers. This device is designed for use with processors using a LGA-1151 socket from Intel and is compatible with both Skylake and Kaby Lake CPUs. It will also fit on motherboards using a smaller LGA-1150 socket.
The ATS-18E-144-C1-R0 heat sink is made from anodized aluminum, with fins that are designed to maximize surface area for better heat dissipation. The large size of the heat sink allows it to effectively dissipate the large thermal loads generated by high-performance CPUs. The fins of the ATS-18E-144-C1-R0 are optimized to provide excellent cooling performance even at low speeds.
ATS-18E-144-C1-R0 Working Principle
The way a heat sink works is by transferring the heat generated by the CPU away from the surface of the processor. This is done through a combination of convection and radiation. Convection is the process of heat traveling from one surface to another as the air around it moves. Radiation, on the other hand, is the process of heat radiation from one surface to another without any air movement.
The ATS-18E-144-C1-R0 uses a combination of both convection and radiation to dissipate the heat generated by the processor. The aluminum fins on the sink draw heat away from the surface of the processor. This heat is then transferred to the air through convection. The air is then moved away by fans, thus further dissipating the heat from the heat sink.
In addition to the use of fans, the fins of the ATS-18E-144-C1-R0 are designed to optimize the radiation of heat. This is done through the use of a sandwich-type fin arrangement, where hot air is trapped between two fins to increase the surface area for better heat transfer. This arrangement helps to maximize the heat transfer between the fins and the air.
The ATS-18E-144-C1-R0 is designed to provide excellent cooling performance, while also being compatible with most modern CPU sockets. It is easy to install and requires little maintenance. The large size of the heat sink ensures that it can dissipate large thermal loads generated by high-performance CPUs. Additionally, the optimized fin arrangement helps to maximize the transfer of heat from the fins to the air.
The specific data is subject to PDF, and the above content is for reference