ATS-18E-148-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.56°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat SinksHeat sinks are thermal management devices used to improve the performance and longevity of electronic components by dissipating and transferring heat away from the components and into the surrounding environment. ATS-18E-148-C1-R0 is one type of heat sink, specifically designed for applications where size restrictions are an issue. It is a miniature-sized heat sink that is made of aluminum material and has an overall height of 18mm, a width of 148mm, and a depth of C1. Its R0 grade ensures that it is allowed to operate at safe and efficient temperatures.The main function of ATS-18E-148-C1-R0 is to dissipate heat generated by electronic components, such as integrated circuits and power transistors, into their environment. The heat sink does this using the concept of conduction, where the heat from the component is transferred to the heat sink’s metallic surface before being dissipated away into the surrounding environment. The heat dissipation occurs due to the heat sink’s exposed metal surface, which has a much larger surface area than the component itself, allowing heat to efficiently transfer away from the component. In addition, the heat sink is designed with several fins that further increases the surface area and allows for more efficient heat dissipation.Aside from dissipating the heat, the heat sink also helps to improve air circulation around the component and its housing. This helps to keep the component at an optimal temperature and prevents it from being damaged due to overheating.In terms of applications, the ATS-18E-148-C1-R0 heat sink can be used for many different types of components, such as power transistors, voltage regulators, and microprocessors. Its small size makes it ideal for applications where space is limited. The heat sink can also be used for cooling devices with high levels of power output, including industrial and military communications equipment, as well as other power-intensive electronic components.Overall, the ATS-18E-148-C1-R0 heat sink is an efficient and reliable way to keep electronic components running at optimal temperatures. Its lightweight and low-profile design make it a perfect solution for applications where size restrictions are an issue. It offers a great balance between cooling performance and cost-effectiveness, making it suitable for many different applications.

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