| Allicdata Part #: | ATS-18E-16-C1-R0-ND |
| Manufacturer Part#: |
ATS-18E-16-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-18E-16-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are widely used for dissipating heat from electronic components and other sources of heat in order to keep them from exceeding their expected temperature ranges. The ATS-18E-16-C1-R0 heat sink is a thermal solution designed to spread out the heat generated from many sources and reduce its intensity distribution to improve the performance and lifespan of your components. This article will provide an overview of the ATS-18E-16-C1-R0\'s application field and working principle.
Application Field
The ATS-18E-16-C1-R0 can be used in a variety of applications. It is suitable for cooling components such as CPUs, GPUs, and other processors, as well as processors used in critical equipment that require reliable performance under high temperatures. It is also suitable for cooling high-current components such as FETs, AC/DC drives, and servo motors. The ATS-18E-16-C1-R0’s excellent thermal performance in a wide range of conditions makes it suitable for use in a variety of consumer, industrial, and commercial applications.
Work Principle
In order to achieve effective cooling, the ATS-18E-16-C1-R0 uses a combination of technologies to efficiently disperse heat. Its three main features—heat dissipation, heat convection, and heat radiation—all work together to draw heat away from the component and spread it out over a larger area. The heat sink’s underside is designed to draw heat away from the component using the principle of natural convection, a process in which warmer air rises and cooler air sinks. A built-in fan then circulates air within the heat sink, effectively cooling the component.
The ATS-18E-16-C1-R0 also makes use of metallic heat-conductive materials such as copper, aluminum, and brass to draw heat away from the component and spread it out over a larger area. These heat-conductive materials are designed to quickly absorb heat from the component and transfer it to other materials such as plastic and rubber. The heat-conductive materials also reduce the temperature of hot spots, ensuring uniform cooling throughout the heat sink.
Finally, the ATS-18E-16-C1-R0 is designed to make use of the heat radiating off of the component using radiative cooling. As the heat is dissipated, the fan circulates air around the heat sink to draw off the heat and keep the component from overheating.
In summary, the ATS-18E-16-C1-R0 is a thermal solution designed to spread out the heat generated from many sources and reduce its intensity distribution to improve the performance and lifespan of your components. Its combination of technologies—heat dissipation, convection, and radiation—make it a suitable choice for cooling components in consumer, industrial, and commercial applications.
The specific data is subject to PDF, and the above content is for reference
ATS-18E-16-C1-R0 Datasheet/PDF