| Allicdata Part #: | ATS-18E-166-C1-R0-ND |
| Manufacturer Part#: |
ATS-18E-166-C1-R0 |
| Price: | $ 3.08 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18E-166-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.77011 |
| 30 +: | $ 2.69514 |
| 50 +: | $ 2.54533 |
| 100 +: | $ 2.39564 |
| 250 +: | $ 2.24590 |
| 500 +: | $ 2.17103 |
| 1000 +: | $ 1.94643 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.12°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a type of thermal management product commonly used to dissipate heat generated by electronic components and maintain high levels of performance in electronic applications. The ATS-18E-166-C1-R0 heat sink is a type of high-performance heat sink that is designed to provide superior performance and reduce power losses in applications that require effective thermal management.
The main characteristics of the ATS-18E-166-C1-R0 heat sink are its excellent thermal properties, superior heat dissipation, and low thermal resistance. It is constructed from a high-performance aluminum extrusion that is highly durable and offers excellent thermal conductivity. It also has a unique design that allows airflow from the cooling fins to flow more efficiently. Additionally, the ATS-18E-166-C1-R0 heat sink has a unique fin shape that gives it superior cooling performance compared to other heat sinks with similar construction.
The working principle of the ATS-18E-166-C1-R0 heat sink is based on the conduction of thermal energy away from the hot surface of the device and into the cool air through the heat sink’s fins. As the air passes through the fins, some of the thermal energy is dissipated out into the air, and some of the heat is transferred back to the heat sink through the fins. This heat then dissipates out of the heat sink via convection, radiating out into the environment.
The unique design of the ATS-18E-166-C1-R0 heat sink allows it to be used in a variety of different applications, including LED lighting, power electronics, telecommunications, and HVAC systems. Its superior thermal properties and efficient design make it an ideal solution for applications where good thermal management is critical for system operation. Its compact size and lightweight construction also make it a great choice for applications where space is at a premium.
The ATS-18E-166-C1-R0 heat sink is designed to be used in a variety of demanding electronic applications, where reliable thermal management is necessary for optimal performance. It is an ideal solution for applications where there is limited space and high thermal loads are expected. Its excellent thermal performance, durability, and reasonable cost make it an ideal choice for those seeking high-performance thermal management solutions.
The specific data is subject to PDF, and the above content is for reference