| Allicdata Part #: | ATS-18E-170-C1-R0-ND |
| Manufacturer Part#: |
ATS-18E-170-C1-R0 |
| Price: | $ 3.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18E-170-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.04353 |
| 30 +: | $ 2.96100 |
| 50 +: | $ 2.79657 |
| 100 +: | $ 2.63208 |
| 250 +: | $ 2.46758 |
| 500 +: | $ 2.38533 |
| 1000 +: | $ 2.13857 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.02°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction
Thermal heat sinks such as the ATS-18E-170-C1-R0 have a long history of providing efficient heat dissipation solutions for applications ranging from consumer electronics to industrial machinery. Thermal heat sinks work by convecting heat away from components via air or a liquid. They often consist of a metal chassis, often aluminum or copper, to which a thin sheet of aluminum or copper is attached. This thin sheet has a large area that creates a large surface area for efficient heat transfer.
Working Principle
Thermal heat sinks, such as the ATS-18E-170-C1-R0, work by increasing the surface area of the component to which they are attached. The greater the surface area, the greater the rate of heat transfer. The increased surface area improves the thermal resistance of the system and allows heat to be dissipated more efficiently and quickly from the component. This is achieved by radiating heat energy into the atmosphere or transferring heat away from the component via a liquid medium.
Application Field
The ATS-18E-170-C1-R0 thermal heat sink can be used in a variety of applications due to its efficient heat dissipation capability. The device can be found in consumer electronics products such as cell phones, tablets, and laptop computers. It can also be found in larger applications, such as industrial machinery and even automobiles. The ATS-18E-170-C1-R0 is an excellent choice for any application where efficient heat management is required.
Benefits of ATS-18E-170-C1-R0 Thermal Heat Sink
The ATS-18E-170-C1-R0 offers ample benefits for its users. It is designed to provide optimal thermal management in a wide variety of applications. The device is made from high-grade aluminum and copper, making it extremely durable and reliable. It also offers excellent heat dissipation capabilities and is designed to handle high temperature and power demands. The device also offers a wide variety of mounting styles, making it highly versatile and suitable for any application.
Conclusion
The ATS-18E-170-C1-R0 is an excellent thermal heat sink. It is designed to provide efficient heat dissipation in a variety of applications. The device is made from durable and reliable materials and offers a wide variety of mounting styles. This makes it an ideal choice for both consumer electronics and industrial applications. If you are looking for an efficient and reliable thermal heat sink, then the ATS-18E-170-C1-R0 is the perfect choice.
The specific data is subject to PDF, and the above content is for reference