| Allicdata Part #: | ATS-18E-184-C3-R0-ND |
| Manufacturer Part#: |
ATS-18E-184-C3-R0 |
| Price: | $ 4.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-18E-184-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.81717 |
| 30 +: | $ 3.60507 |
| 50 +: | $ 3.39293 |
| 100 +: | $ 3.18087 |
| 250 +: | $ 2.96881 |
| 500 +: | $ 2.75675 |
| 1000 +: | $ 2.70374 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become increasingly important in the industrial sector due to the proliferation of electronic and information-based devices and the increase in energy efficiency requirements. Thermal management solutions such as heat sinks and thermoelectric coolers can help regulate the temperatures of electronic components by dissipating or transferring heat away from them, depending on the application. A particular type of heat sink, the ATS-18E-184-C3-R0, can be used in a variety of applications and is designed to help maintain and regulate part or component temperatures.
The ATS-18E-184-C3-R0 has a 120x120mm base for mounting on the top of a component, and an aluminum fin stack on the top, with an octal shape. The total fin stack height is 18 mm, and its thermal performance rating is 0.46°C/W. This type of heat sink features an ultra-thin vertical wall type heat sink, with a narrow fin gap structure that allows for high airflow while still providing effective thermal performance. The ATS-18E-184-C3-R0 also features an integrated heat pipe for better cooling performance and increased thermal dissipating area.
The ATS-18E-184-C3-R0 heat sink can be used in a variety of applications, including those related to military, aerospace, consumer electronics, automotive, and telecommunication industries. Because of its size, it is particularly well suited for applications in places with limited space or with high-density components. In addition, the heat sink\'s aluminum fin stack surface area increases its thermal performance, allowing it to better meet extreme temperature demands.
The working principle of the ATS-18E-184-C3-R0 heat sink is thermal conduction. Heat is removed from the hot component or part via the aluminum fin stack, and is then dissipated into the surrounding environment. The ultra-thin aluminum fin stack features narrow fin gaps that allow for higher airflow, and the integrated heat pipe further enhances the heat sink\'s cooling performance. The heat pipe is a copper tube filled with a refrigerant liquid, and when heated it evaporates and transfers the heat away from the component. This helps the ATS-18E-184-C3-R0 efficiently cool and regulate part or component temperatures by helping to quickly dissipate heat.
The ATS-18E-184-C3-R0 is a versatile thermal management solution that can be used in a variety of applications and help maintain and regulate part or component temperatures. Its ultra-thin aluminum fin stack and integrated heat pipe make it an ideal choice for high-density configurations, and its efficient thermal conduction properties help quickly dissipate heat away from components. This makes the ATS-18E-184-C3-R0 a valuable tool for industrial and commercial applications where thermal management is critical.
The specific data is subject to PDF, and the above content is for reference
ATS-18E-184-C3-R0 Datasheet/PDF