| Allicdata Part #: | ATS-18E-188-C1-R0-ND |
| Manufacturer Part#: |
ATS-18E-188-C1-R0 |
| Price: | $ 3.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18E-188-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.32892 |
| 30 +: | $ 3.23862 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.65°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
ATS-18E-188-C1-R0 is a heat sink which for thermal cooling solutions. It is a designed engineering material with combined design principles of high thermal conductivity and efficient heat release that is needed in order to cool electronic components. This heat sink design is under the umbrella of the thermal management industry and specializes in heat sinks to help reduce the heat output of components. It has been used in the semiconductor and circuit board industries with great success since its introduction.
Application
The main application of ATS-18E-188-C1-R0 is in the heat transfer industry specifically in the cooling of electronics. This type of heat sink is suitable for applications that require extreme heat transfer capacity such as telecommunications, computers, automotive sensors, and high power LEDs. It also finds application in cooling surfaces of various chemical and metal alloy systems. This heat sink has been designed to provide reliable heat transfer performance in cooling electronics in a wide range of temperatures from -xxoC to +xxoC. It is also suitable for applications where fast cooling is required, such as in telecommunications.
Working Principle
ATS-18E-188-C1-R0 is designed to use a combination of heat pipe technology and heat dissipation for efficient heat transfer. The heat transfer is achieved by using an enclosed, hermetically sealed aluminum-silicone alloy. Heat from the enclosed Unit is transferred to the aluminum-silicone alloy and then dissipated directly into the surrounding air. This process is known as natural convection. Natural convection is an important aspect of heat transfer as it enables the heat sink to be self-regulated and absorb a wide range of temperatures efficiently.
In the aluminum-silicone alloy, there are thermally conductive silicone fins, allowing air to flow between them. This aids in the dissipation of heat. The fins are designed to capture the heat from the inside of the enclosure and transfer it to the outside, allowing the air to act as a medium to dissipate the heat of the fins to the atmosphere. The combination of the efficient heat transfer capabilities and the cooling fins increases the heat transfer surface area enabling the heat sink to keep the inside of the enclosure cool.
Conclusion
ATS-18E-188-C1-R0 is a highly efficient heatsink design with excellent natural convection capabilities. It is ideal for use in cooling a variety of electronic components in temperatures ranging from -xxoC to +xxoC. Its combination of heat pipe technology and heat dissipation provides efficient and reliable heat transfer. Its fins enable it to capture and transfer heat from inside the enclosure to the outside for efficient cooling in a wide range of applications.
The specific data is subject to PDF, and the above content is for reference