ATS-18E-198-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-18E-198-C3-R0-ND

Manufacturer Part#:

ATS-18E-198-C3-R0

Price: $ 3.58
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X12MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-18E-198-C3-R0 datasheetATS-18E-198-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.25710
30 +: $ 3.16932
50 +: $ 2.99326
100 +: $ 2.81717
250 +: $ 2.64109
500 +: $ 2.55305
1000 +: $ 2.28894
Stock 1000Can Ship Immediately
$ 3.58
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.472" (12.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.21°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a vital part of any system design, and thermal management products like the ATS-18E-198-C3-R0 heat sink are essential components. Heat sinks are a type of passive cooling system and are used to dissipate heat away from a hot surface, usually an electronic component. The ATS-18E-198-C3-R0 is a relatively small but high-performance heat sink designed for applications in the consumer electronics, IT, telecommunication, and automotive industries.This heat sink is constructed from a combination of aluminum and copper and is designed with a 3-fin rectangular extrusion with an anodized treatment to improve its thermal efficiency. It has a fin depth of 199mm, a fin length of 240mm, and an overall height of 4mm. It also has a thermal resistance of 0.30 °C/W and is capable of dissipating up to 140W of power. The base of the ATS-18E-198-C3-R0 is designed with a flat surface for effective contact with the device that is to be cooled, as well as an array of air vents to provide the necessary amount of ventilation.The ATS-18E-198-C3-R0 is highly effective at dissipating heat away from hot spots in electronic components. In order to do this, they employ the principles of forced and natural convection. Natural convective air currents move heat away from hot spots to cooler parts of a system, while forced convection requires fans and other cooling devices to create a higher flow of air for improved cooling. This is why many system designs will incorporate both natural and forced convection when cooling high-performance components.The ATS-18E-198-C3-R0 is also designed for easy installation and maintenance. It can be easily mounted using screws and nuts, and can even be attached to a motherboard using a specialized clip. The design also ensures that it can be removed without having to take apart the entire system, thus minimizing downtime.The ATS-18E-198-C3-R0 is an excellent choice for thermal management systems in a variety of industries. Its small size and high cooling performance make it ideal for consumer electronics, IT, telecommunication and automotive applications. Furthermore, it’s easy installation makes it a great option for anyone looking for a reliable and cost-effective solution for their thermal management needs.

The specific data is subject to PDF, and the above content is for reference

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