| Allicdata Part #: | ATS-18E-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-18E-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18E-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important part of any electrical and electronic system\'s design process. Heat is produced when electricity flows through its components and dissipates it into the surrounding environment. Thermal components, such as heat sinks, are used to efficiently cool these components and avoid any potential issues such as thermal runaway due to high temperatures.
One such component is the ATS-18E-20-C3-R0 heat sink. It is a high-performance, closed-loop heat sink made from extruded aluminum, and features a unique design that helps to evenly distribute and dissipate heat. It also has a unique inner flow channel system that increases overall heat dissipation by providing additional air contact with the heat sink and decreasing the resistance associated with air flow. With a 1.5-inch fan, this unit is able to provide an airflow of up to 250 CFM to help reduce temperatures and keep components within their optimal operating range.
The ATS-18E-20-C3-R0 heat sink is often used in applications where heat needs to be effectively dissipated. It is often used in industrial applications ranging from medical equipment, telecommunications, automotive systems, and more. Due to its superior cooling capabilities, it is also used in applications where thermal management is more critical, such as high-end gaming PCs or data centers.
The core of the ATS-18E-20-C3-R0 heat sink is its ability to dissipate heat effectively. The extruded aluminum construction paired with the inner channel system helps to ensure that the heat is evenly spread across the surface of the sink, increasing its overall heat dissipation capabilities. Additionally, the 1.5-inch fan helps to increase air contact with the sink and reduce air resistance, further helping to decrease temperatures.
The ATS-18E-20-C3-R0 heat sink is an ideal solution for applications where thermal management is a critical factor. Its superior cooling abilities make it suitable for both industrial and consumer applications that need a reliable heat sink. Additionally, its ease of installation and variety of mounting options make it suitable for a wide variety of applications.
The specific data is subject to PDF, and the above content is for reference