| Allicdata Part #: | ATS-18E-200-C1-R0-ND |
| Manufacturer Part#: |
ATS-18E-200-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-18E-200-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.76°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-18E-200-C1-R0 is a type of thermal heat sink designed to improve heat dissipation in various electronic devices. The heat sink is designed for use in a wide range of applications, including automotive electronics, lighting, communications, and medical electronics. The heat sink consists of an aluminum base, which acts as a passive heat spreader that is connected to the device, and several fins arranged in a special design that helps dissipate heat effectively.
This type of heat sink uses conduction to transfer heat from the device to the aluminum base and then to the fins. Heat travels through the fins and is transferred from the fins to the outside environment through natural convection. The base of the heat sink is designed to dissipate the maximum amount of heat with minimal air resistance, further aiding the cooling process. The aluminum base also acts as an effective thermal conductor, allowing maximum heat transfer from the device.
Using a combination of advanced thermal engineering and innovative design techniques, the ATS-18E-200-C1-R0 heat sink is extremely efficient and provides superior thermal performance. The aluminum base and fins are designed to maintain a consistent, uniform temperature regardless of the application. The heat sink also features advanced air flow and cooling technology, which provides extra cooling power for optimal thermal performance. In addition, the fins are shaped in a contoured manner to maximize air flow and reduce noise.
The ATS-18E-200-C1-R0 thermal heat sink is designed for use in a variety of electronic devices, including automotive, communications, medical, and lighting applications. The heat sink is perfect for cooling down high performance components, GPUs, FPGAs, and other digital systems. The superior cooling performance ensures that the device runs at optimal temperatures, without compromising on performance.
The ATS-18E-200-C1-R0 thermal heat sink is designed to be lightweight, durable, and easy to install and maintain. The thermal performance and construction make it suitable for a range of applications, while the high quality materials and design ensure a long lifetime of reliable performance.
The specific data is subject to PDF, and the above content is for reference